Soldering & Surface Mount Technology
Issue(s) available: 131 – From Volume: 1 Issue: 1, to Volume: 36 Issue: 5
A study on the effect of the geometric properties and surface defects on silicon chip flexibility for wearable electronics
Yan Pan, Taiyu Jin, Xiaohui Peng, Pengli Zhu, Kyung W. PaikThe purpose of this paper was to investigate how variations in the geometry of silicon chips and the presence of surface defects affect their static bending properties. By…
Wettability and microstructure transformations of YAG ceramic brazing to kovar alloy with AgCuTi filler alloy
Wei Lin, Cheng Wang, Qingyi Zou, Min Lei, Yulong LiThis paper aims to conduct work to obtain high-quality brazed joint of YAG ceramic and kovar alloy.
Comparative study of machine learning method and response surface methodology in BGA solder joint parameter optimization
Fang Liu, Zhongwei Duan, Runze Gong, Jiacheng Zhou, Zhi Wu, Nu YanBall grid array (BGA) package is prone to failure issues in a thermal vibration-coupled environment, such as deformation and fracture of solder joints. To predict the minimum…
Effect of adding Ni nanoparticles on the melting characteristics, mechanical properties and intermetallic compound growth of Sn58Bi solder
Jiamin Zhang, Liang Zhang, Xi Huang, Chuanjiang Wu, Kai Deng, Wei-Min LongThis paper aims to investigate the improvement of Sn58Bi solder properties by Ni nanoparticle to provide theoretical support in the field of electronic packaging.
Application and practice of LILCEO sintering proportion optimization algorithm in sintering plant
Lingzhi Yi, Kai Ren, Yahui Wang, Wei He, Hui Zhang, Zongping LiTo ensure the stable operation of ironmaking process and the quality and output of sinter, the multi-objective optimization of sintering machine batching process was carried out.
Advancing packaging technology: computational fluid dynamics modeling for capillary underfill encapsulant in multi-chip heterogenous packages
Muhammad Aqil Azman, Mz Abdullah, Wei Keat Loh, Chun Keang OoiThe purpose of this study is to investigate the dynamics of capillary underfill flow (CUF) in flip-chip packaging, particularly in a multi-chip configuration. The study aims to…
Image segmentation on void regional formation in the flip-chip underfilling process by comparing YOLO and mask RCNN
Calvin Ling, Cheng Kai Chew, Aizat Abas, Taufik AzahariThis paper aims to identify a suitable convolutional neural network (CNN) model to analyse where void(s) are formed in asymmetrical flip-chips with large amounts of the ball-grid…
Effects of Ni addition on wettability and interfacial microstructure of Sn-0.7Cu-xNi solder alloy
Jinshuai Xie, Lei Tang, Pengfei Gao, Zhengquan Zhang, Liangfeng LiThis paper aims to study the effect of different Ni content on the microstructure and properties of Sn-0.7Cu alloy. Then, the spreading area, wetting angle, interface layer…
Effects of soldering temperature and preheating temperature on the properties of Sn–Zn solder alloys using wave soldering
Songtao Qu, Qingyu Shi, Gong Zhang, Xinhua Dong, Xiaohua XuThis study aims to address the problem of low-temperature wave soldering in industry production with Sn-9Zn-2.5 Bi-1.5In alloys and develop qualified process parameters. Sn–Zn…
Effect of sintering temperature on ratcheting-fatigue behavior of nanosilver sintered lap shear joint
Danqing Fang, Chengjin Wu, Yansong Tan, Xin Li, Lilan Gao, Chunqiu Zhang, Bingjie ZhaoThe paper aims to study the effect of sintering temperature on the microstructure, shear strength and ratcheting fatigue life of nanosilver sintered lap shear joint. In addition…
Elastoplastic nanoindentation behaviors of sintered nano-silver under various sintering parameters
Yanwei Dai, Libo Zhao, Fei Qin, Si ChenThis study aims to characterize the mechanical properties of sintered nano-silver under various sintering processes by nano-indentation tests.
Microstructure and mechanical behavior of Sn15Bi-xAg\Cu solder joints during isothermal aging
Fengjiang Wang, Dapeng Yang, Guoqing YinThis paper aims to focus on the reliability of Sn15Bi–xAg and Sn15Bi–xCu solder joints during isothermal aging.
The preparation and wettability of the Sn-9Zn-2.5Bi-1.5In solder paste for SMT process and high shear ball performance
Bingyi Li, Songtao Qu, Gong ZhangThis study aims to focus on the surface mount technology (SMT) mass production process of Sn-9Zn-2.5Bi-1.5In solder. It explores it with some components that will provide…
Influences of hygrothermal conditions and structure parameters on moisture diffusion behavior in a system‐in‐package module by moisture-thermal-mechanical-coupled finite element modeling
Li Liu, Chunhua Zhang, Ping Hu, Sheng Liu, Zhiwen ChenThis paper aims to investigate the moisture diffusion behavior in a system-in-package module systematically by moisture-thermalmechanical-coupled finite element modeling with…
Influence of doping Si3N4 nanoparticles on the properties and microstructure of Sn58Bi solder for connecting Cu substrate
Kai Deng, Liang Zhang, Chen Chen, Xiao Lu, Lei Sun, Xing-Yu GuoThis study aims to explore the feasibility of adding Si3N4 nanoparticles to Sn58Bi and provides a theoretical basis for designing and applying new lead-free solder materials for…
ISSN:
0954-0911e-ISSN:
1758-6836ISSN-L:
0954-0911Online date, start – end:
1989Copyright Holder:
Emerald Publishing LimitedOpen Access:
hybridEditors:
- Professor Peng He
- Associate Professor Shuye Zhang
Further Information
