Soldering & Surface Mount Technology: Volume 19 Issue 4

Assembly issues with Sn/Ag/Cu bumped flip chips

The objective of this research is to address issues that relate to the assembly of Sn/Ag/Cu bumped flip chips.

Hydrocarbon fluxes for ionic compound free soldering

The purpose of this paper is to develop a new ionic compound free soldering process.

Characterization of SnAgCu and SnPb solder joints on low‐temperature co‐fired ceramic substrate

The purpose of this paper is to present the results of experiments performed to attach silicon dies (chips) to low‐temperature co‐fired ceramic (LTCC) substrates with Ag or AgPd…

Low cycle isothermal fatigue properties of lead‐free solders

The purpose of this paper is to discuss a new method to measure the fatigue of single solder joints in shear, and hence calculate the joint strain energy density in each fatigue…

Grove fuel cell symposium showcased DEK's enhanced fuel cell expertise

Arka Technologies launches revolutionary Smartshield™ EMI shielding product

A-Series Assembléon Manufacturing Suite (AMS) optimises SMT production line performance

Siemens honoured with Delphi Corporation's Pinnacle Award

Online auction offers new alternative

Military certification for HumiSeal's UV40 range

NBS Design expands its PCB layout business nationally

Lord Corporation announces advancements in flip chip underfill technology for lead-free component packaging

“Adhere” diaphragm valve dispenses UV adhesives

Selective soldering system from Contax meets Jaltek's requirements

Contax sells first FX-D after Nepcon launch for medical device production

RFTRAQ purchases Contax equipment to manufacture active RFID hardware

Exerra appoints Don Beard Engineering Manager for North America

DEK's packaging innovations land two industry honours

OK International launches new APR-5000-DZ array package rework system with dual convection bottom-side heating for lead-free rework and high-thermal demand applications