Soldering & Surface Mount Technology: Volume 29 Issue 3

Study of direct soldering of silicon and copper substrate by use of Bi-based solders with lanthanides addition

Roman Kolenak

This paper aims to investigate the effect of solder alloying with a small amount of La and Y on bond formation with the Si and Cu substrates.

Thermal decomposition of solder flux activators under simulated wave soldering conditions

Kamila Piotrowska, Morten Stendahl Jellesen, Rajan Ambat

The aim of this work is to investigate the decomposition behaviour of the activator species commonly used in the wave solder no-clean flux systems and to estimate the residue…

Reflow of tiny 01005 capacitor/SAC305 solder joints in protective atmosphere

Yeqing Tao, Dongyan Ding, Ting Li, Jason Guo, Guoliang Fan

This paper aims to study the influence of reflow atmosphere and placement accuracy on the solderability of 01005 capacitor/SAC305 solder joints.

Cu/SnAgCu/Cu TLP with different thicknesses for 3D IC

Liang Zhang, Zhi-quan Liu, Fan Yang, Su-juan Zhong

This paper aims to investigate Cu/SnAgCu/Cu transient liquid phase (TLP) bonding with different thicknesses for three-dimensional (3D) integrated circuit (IC).

Research on microstructure and mechanical behaviour of smaller microbumps for high density solder interconnects

Man He, Bo Wang, Weisheng Xia, Shijie Chen, Jinzhuan Zhu

The purpose of this paper is to study the microstructure and mechanical behaviour of smaller microbumps for high density solder interconnects.

Solder joint defect classification based on ensemble learning

Hao Wu

This paper aims to inspect the defects of solder joints of printed circuit board in real-time production line, simple computing and high accuracy are primary consideration factors…