Soldering & Surface Mount Technology: Volume 32 Issue 4

Guest editorial

Agata Skwarek

The influence of soldering process parameters on the optical and thermal properties of power LEDs

Przemysław Ptak, Krzysztof Górecki, Agata Skwarek, Krzysztof Witek, Jacek Tarasiuk

This paper aims to present the results of investigations that show the influence of soldering process parameters on the optical and thermal parameters of power LEDs.

Low-voiding solder pastes in LED assembly

Barbara Dziurdzia, Maciej Sobolewski, Janusz Mikołajek, Sebastian Wroński

This paper aims to investigate voiding phenomena in solder joints under thermal pads of light-emitting diodes (LEDs) assembled in mass production environment by reflow soldering…

Numerical investigation on the effect of solder paste rheological behaviour and printing speed on stencil printing

Oliver Krammer, Tareq I. Al-Ma’aiteh, Balazs Illes, David Bušek, Karel Dušek

The purpose of this paper is to investigate the effect of different viscosity models (Cross and Al-Ma’aiteh) and different printing speeds on the numerical results (e.g. pressure…

Selective etching and hardness properties of quenched SAC305 solder joints

Muhamad Zamri Yahaya, Nor Azmira Salleh, Soorathep Kheawhom, Balazs Illes, Muhammad Firdaus Mohd Nazeri, Ahmad Azmin Mohamad

The purpose of this paper is to investigate the morphology of intermetallic (IMC) compounds and the mechanical properties of SAC305 solder alloy under different cooling conditions.

Structural characterization of inkjet printed capacitor layers in various technological conditions

Milena Kiliszkiewicz, Dariusz Przybylski, Jan Felba, Ryszard Korbutowicz

The purpose of this paper is to analyze the individual steps during the printing of capacitor structures. The method of substrate preparation, the obtained roughness of conductive…

Impact of convection on thermographic analysis of silver based thermal joints

Krzysztof Jakub Stojek, Jan Felba, Johann Nicolics, Dominik Wołczyński

This paper aims to develop thermal analysis method of thermal joints characterization. The impact on convection on thermal resistance analysis with use thermography for…

Heat transfer aspects of condensation during vapour phase soldering on aligned PCB-based surfaces

Daniel Straubinger, István Bozsóki, Balazs Illes, Oliver Krammer, David Bušek, Attila Geczy

The paper aims to present an investigation on heat transfer in a vapour phase soldering (VPS) oven, focusing on the differences of horizontally and vertically aligned Printed…

Effect of different thermocouple constructions on heat-level vapour phase soldering profiles

Mohamed Amine Alaya, Viktória Megyeri, David Bušek, Gábor Harsányi, Attila Geczy

To improve productivity and reach better quality in assembling, measurements and proper process controlling are a necessary factor. This study aims to focus on the monitoring…