Soldering & Surface Mount Technology: Volume 22 Issue 3

Effect of Bi on the microstructure and tensile behavior of Sn‐3.7Ag solders

The purpose of this paper is to investigate a Pb‐free solder alternative, specifically the effect of Bi on the microstructure and tensile strength of Sn‐3.7Ag solders casted under…

Investigation of Sn‐Zn‐Bi solders – Part I: surface tension, interfacial tension and density measurements of SnZn7Bi solders

The purpose of Part I of this paper is to investigate the influence of Bi additions on the surface tension, the interfacial tension, and the density of SnZn7Bi alloys (Bi=1 and 3…

Investigation of the effect of nitrogen and air atmospheres on solder wettability of plasma‐treated HASL finish PCBs

The purpose of this paper is to evaluate the effect of nitrogen and air atmospheres on the solderability testing of plasma‐treated hot air solder level (HASL) finish printed…

Effect of ENIG deposition on the failure mechanisms of thermomechanically loaded lead‐free 2nd level interconnections in LTCC/PWB assemblies

The purpose of this paper is to investigate the effect of electroless NiAu (ENIG) deposition on the failure mechanisms and characteristic lifetimes of three different…

Experimental investigation on the failure of lead‐free solder joints under drop impact

The purpose of this paper is to investigate the mechanism of ball grid array (BGA) lead‐free solder joint failure under board‐level drop impact.

Thermal cycling of flip chips on FR‐4 and PI substrates with parylene C coating

The purpose of this paper is to study the effect of conformal coating on the thermal cycling reliability of anisotropically conductive adhesive film (ACF) joined flip chip…

The new SIPLACE SX

Enhanced reflow cooling technology introduced by Rehm Thermal Systems

IFS 2010

Proprietary thermal technology enhances PV tabbing and bussing soldering results

International diary

New appointment drives Marantz’s expansion into solder paste inspection

Intertronics offer improved UV curing control

Update of IPC J-STD-609 provides greater delineation of lead-free solders for marking and labelling

Editorial

Updates to IPC-6012 and IPC-A-600 released: Five Years of New Board Technologies and Processes Bring Significant Changes to Specifications

Etek signs with ATF

Further investment from CIL with purchase of additional selective soldering machine

Zhejiang Hongchen purchases even more solar metallisation lines from DEK

ITRI launches new association management and events company

Removing the shock factor

Aries’ BGA Switch-A-Pitch adapters enable cost-effective use of 0.40-mm pitch devices with 1.00-mm pitch boards

Packaging and interconnection for electronics and sensors – past, present and future

New SIPLACE import function for irregular BGAs

New order bookings for SMT equipment continue to rise worldwide

Rehm Thermal Systems sign agreement with DPI SRL as new representative for condensation soldering systems in Italy

IPC J-STD-001E released: Industry Requirements for Soldered Electrical and Electronic Assemblies Updated

AdoptSMT Group opens new office in the UK

DEK International GmbH receives Intel’s prestigious Supplier Continuous Quality Improvement award

NBS enhances its manufacturing process control capabilities with 3D solder paste inspection