Soldering & Surface Mount Technology: Volume 23 Issue 2

Understanding the effects of addition of copper nanoparticles to Sn‐3.5 Ag solder

The purpose of this paper is to focus on the fabrication of SAC nanocomposites solder and discuss the effects of nanoCu addition on the structure and properties of resulted…

Effect of particle size distribution (PSD) and flux medium on the creep recovery performance of lead‐free solder pastes

The purpose of this paper is to investigate how the formulation of a solder paste (with regards to the flux and particle size distribution (PSD)), can influence its creep and…

Comparison of ROSE, C3/IC, and SIR as an effective cleanliness verification test for post soldered PCBA

The purpose of this paper is to evaluate and compare the effectiveness and sensitivity of different cleanliness verification tests for post soldered printed circuit board…

Stability investigations of automatic X‐ray inspection systems

The purpose of this paper is to develop a new method of evaluating the present state of X‐ray machines used in the electronics device manufacturing industry.

Enhanced thermal fatigue endurance and lifetime prediction of lead‐free LGA joints in LTCC modules

The purpose of this paper is to describe the effect of indium alloying on the thermal fatigue endurance of Sn3.8Ag0.7Cu solder in low‐temperature co‐fired ceramic (LTCC) modules…

Effect of solder joint integrity on the thermal performance of a TEC for a 980 nm pump laser module

The purpose of this paper is to evaluate the effect of solder wettability on the thermal performance of a thermo‐electric cooler (TEC) of a 980 nm pump laser module.

Arrow Medical’s new UV curing lines expand facility to 3,100 sq.ft. for single-use medical device production

Assembléon – the future

Essemtec AG overcomes the industry crises strengthened and with new products

Enthone introduces AlphaSTARR 420R PWB creep and flaking corrosion inhibitor

Powerful x|act: software now available for GE’s phoenix high-resolution X-ray inspection systems

Electronica 2010, Munich, Germany, 9-12 November 2010

Park Electrochemical appoints Christopher Mastrogiacomo to Senior Vice President of Strategic Marketing

SIPLACE team becomes ASM Assembly Systems

Norlux expanded its LED manufacturing capability with the addition of a DEK Horizon 03iX printing platform

Makso chooses MYDATA for 68,000 cph SMT capacity boost

Unlimited training for MYDATA customers

Mini-Cam takes SMT in-house with MYDATA

CEMCO-FSL

GE introduces its phoenix nanotom m: nanoCT® system

DEK launches breakthrough new “fluxophobic” stencil coating technology

Green Photonics Conference, Millennium Centre, Cardiff, 19 October 2010

International diary

HumiSeal® strengthens European team with senior appointment

ASPIS – a new multi-partner research project to enhance the performance of nickel-gold solderable finishes

Editorial

DEK and AGI Mark Expanded Stencil Franchise Relationship with Technology Open House