Table of contents
Dissolution rates of iron plating on soldering iron tips in molten lead‐free solders
Tadashi Takemoto, Takashi Uetani, Morio YamazakiThe dissolution rates of iron and alloyed steels in molten lead‐free solders were investigated in order to clarify the effect of erosion of iron plating on soldering iron tips…
695
A study of SMT assembly processes for fine pitch CSP packages
Minna Arra, David Geiger, Dongkai Shangguan, Jonas SjöbergThe surface mount technology (SMT) assembly process for 0.4 mm pitch chip scale package (CSP) components was studied in this work. For the screen printing process, the printing…
495
A comparison of the quality of lead‐free solder pastes
Janusz Sitek, Dubravka Ročak, Krystyna Bukat, Janeta Fajfar‐Plut, Darko BelavičThe European Commission has decided that from the second half of 2006 only lead‐free solder pastes will be permitted for use in the electronics industry. Earlier results of…
605
Dissolution of solids in contact with liquid solder
Samjid Mannan, Michael P. ClodeThe dissolution rate of a solid metal such as Cu, in contact with molten solder can be calculated with the use of the Nernst‐Brenner equation. We describe how this equation should…
586
ISSN:
0954-0911e-ISSN:
1758-6836ISSN-L:
0954-0911Online date, start – end:
1989Copyright Holder:
Emerald Publishing LimitedOpen Access:
hybridEditors:
- Professor Peng He
- Associate Professor Shuye Zhang