Soldering & Surface Mount Technology: Volume 9 Issue 2

Lead‐free and No‐clean Soldering for Automotive Electronics*

D. Shangguan, G. Gao

As the electronics industry moves towards the 21st century, environmentally consciousmanufacturing is becoming a very important issue for the industry. In recent years…

Microstructural Investigation of Sn‐Ag and Sn‐Ag Solder Joints*

S. Chada, A. Herrmann, W. Laub, R. Fournelle, D. Shangguan, A. Achari

Detailed studies to characterise the coarsening behaviour of eutecticSn‐Ag and near‐eutectic Sn‐Pb‐Ag solder joints were carriedout on samples reflow soldered and solidified at…

An Experimental Method for Refinement of Solderability Measurement

W. Liggett, K.‐W. Moon, C. Handwerker

An experimental method for measurement system improvement is presented and applied to development of a protocol for solderability measurement with a wetting balance. Protocol…

Hard‐particle Reinforced Composite Solders Part 1: Microcharacterisation

J.L. Marshall, J. Calderon

A series of composite solders in 63/37 Sn/Pb was prepared: Cu₆ Sn₅ (10, 20,30 wt%); Cu₃ Sn (10, 20, 30 wt%); Cu (7.6 wt%); Ag (4 wt%); and Ni (4 wt%). These composite solders were…

The Development of High Speed Printing Solder Pastes for Fine Pitch Applications*

M. Warwick, I. Harpley

‘Fine Pitch’and ‘High speed printing’ are relative terms but many solder paste users seecapability in meeting these two requirements as their major goals for process improvements…

Solder Reliability Solutions: A PC‐based Design‐for‐reliability Tool*

J.‐P. CIech

This paper presents a solder joint engineering reliability model —Solder Reliability Solutions** (SRS) — and its application to surface mountarea‐array and chip‐scale assemblies…

New High Thermal Conductivity Thermoplastics for Power Applications

R.L. Dietz, D. Peck, P.J. Robinson, M.G. Firmstone, P.M. Bartholomew, G. Paterson

The trendtowards higher density, higher frequency, higher power active devices in placing increasinglydifficult demands on device packaging. Materials with high thermal…

The Roles of DNP (Distance to Neutral point) on Solder Joint Reliability of Area Array Assemblies

J.H. Lau

The objective of this paper is to point out the limitations and ròles of DNP (distance to neutral point) on predicting the solder‐joint thermal‐fatigue life of area‐array…

Microstructural Modelling and Electronic Interconnect Reliability*

P.R. Winter, E.R. Wallach

Initial development ofmicrostructurally accurate finite element models of the soldered joints of electronic surfacemount components is described. These models allow for the…

Getting Ready for Lead‐free Solders*

N.‐C. Lee

This paper reviews the status of lead‐free solder development works. Some of the solder systems — Bi‐Sn,Bi‐Sn‐Fe, ln‐Sn, Sn, Sn‐Ag, Sn‐Ag‐Zn,Sn‐Ag‐Zn‐Cu, Sn‐Bi‐Ag, Sn‐Cu,Sn‐Cu‐Ag…