Microstructural Investigation of Sn‐Ag and Sn‐Ag Solder Joints*

Abstract

Detailed studies to characterise the coarsening behaviour of eutectic Sn‐Ag and near‐eutectic Sn‐Pb‐Ag solder joints were carried out on samples reflow soldered and solidified at various cooling rates. Light and scanning electron microscopy as well as EDS were used to study the microstructural evolution, while microhardness measurements were used to monitor the change in the mechanical properties. Samples consisting of copper substrates and solder paste were reflow soldered about 30 °C above their melting points and then solidified at cooling rates ranging from furnace cooling to rates associated with water quenching. Analysis of some of these samples showed that increasing the cooling rate increased the quantity (volume fraction) of primary Sn‐dendrites, decreased the (EQ) intermetallic phase in the bulk solder, and resulted in finer microstructures with higher hardness. The microstructural evaluation involved characterisation of bulk intermetallica and dendrite/eutectic ratios. Subsequent isothermal annealing of these reflow soldered joints at 125 °C for times between 0.25 h and 8 days resulted in an initially fairly rapid decrease in hardness to a given level for each alloy and each cooling rate.

Citation

Chada, S., Herrmann, A., Laub, W., Fournelle, R., Shangguan, D. and Achari, A. (1997), "Microstructural Investigation of Sn‐Ag and Sn‐Ag Solder Joints*", Soldering & Surface Mount Technology, Vol. 9 No. 2, pp. 9-13. https://doi.org/10.1108/09540919710800610