The Roles of DNP (Distance to Neutral point) on Solder Joint Reliability of Area Array Assemblies
J.H. Lau
(Express Packaging Systems, Inc., Palo Alto, California, USA)
459
Abstract
The objective of this paper is to point out the limitations and ròles of DNP (distance to neutral point) on predicting the solder‐joint thermal‐fatigue life of area‐array assemblies.
Keywords
Citation
Lau, J.H. (1997), "The Roles of DNP (Distance to Neutral point) on Solder Joint Reliability of Area Array Assemblies", Soldering & Surface Mount Technology, Vol. 9 No. 2, pp. 58-60. https://doi.org/10.1108/09540919710800674
Publisher
:MCB UP Ltd
Copyright © 1997, MCB UP Limited