Table of contents
Surface finish effect on reliability of SAC 305 soldered chip resistors
Maurice N. Collins, Jeff Punch, Richard CoyleThe purpose of this paper is to assess the long‐term reliability of lead‐free Sn96.5Ag3.0Cu0.5 (SAC305) under accelerated temperature cycling (ATC) conditions. Test vehicles…
Interfacial IMC layer growth and tensile properties of low‐silver Cu/SACBE/Cu solder joints
Wenzhen Bi, Guokui Ju, Fei Lin, Shifang Xie, Xicheng WeiIn a previous study, the authors proposed a new low‐silver solder alloy Sn‐ x(1.0, 1.5, 2.0)Ag‐0.3Cu‐3.0Bi‐0.05Er (wt.%) (SACBE) and the purpose of this paper is to provide…
Effect of minor additions of Fe on bulk alloy microstructure and tensile properties of the low Ag‐content Sn‐1Ag‐0.5Cu solder alloy
Dhafer Abdul Ameer Shnawah, Suhana Binti Mohd Said, Mohd Faizul Bin Mohd Sabri, Irfan Anjum Badruddin, Fa Xing CheThe purpose of this paper is to investigate the effects of small additions (0.1 and 0.3 wt%) of Fe on the bulk alloy microstructure and tensile properties of low Ag‐content…
SAC 305 solder paste with carbon nanotubes – part I: investigation of the influence of the carbon nanotubes on the SAC solder paste properties
K. Bukat, J. Sitek, M. Kościelski, M. Jakubowska, M. Słoma, A. Młożniak, W. NiedźwiedźThe purpose of this paper is to study the manufacturing of SAC 305 solder paste with multiwall carbon nanotubes (MWCNT) before and after structure modification and also to…
Effect of Pr on properties and Sn whisker growth of Sn‐9Zn‐xPr solder
Peng Xue, Songbai Xue, Yifu Shen, Zhengxiang Xiao, Hong Zhu, Weimin Long, Xinquan YuThe purpose of this paper is to improve the properties of Sn−9Zn solder, so as to meet the requirements of industrial applications.
Evaluation of Cu/SnAg microbump bonding processes for 3D integration using wafer‐level underfill film
Tsung‐Fu Yang, Kuo‐Shu Kao, Ren‐Chin Cheng, Jing‐Yao Chang, Chau‐Jie Zhan3D chip stacking is a key technology for 3D integration in which two or more chips are stacked with vertical interconnections. In the case of multi chip stacking with fine pitch…
ISSN:
0954-0911e-ISSN:
1758-6836ISSN-L:
0954-0911Online date, start – end:
1989Copyright Holder:
Emerald Publishing LimitedOpen Access:
hybridEditors:
- Professor Peng He
- Associate Professor Shuye Zhang