Soldering & Surface Mount Technology: Volume 33 Issue 2

Automatic optical inspection system for IC solder joint based on local-to-global ensemble learning

Wenjie Chen, Nian Cai, Huiheng Wang, Jianfa Lin, Han Wang

Automatic optical inspection (AOI) systems have been widely used in many fields to evaluate the qualities of products at the end of the production line. The purpose of this paper…

The formation of intermetallic layer structure of SAC405/Cu and SAC405/ENImAg solder joint interfaces

Rabiatul Adawiyah Mohamed Anuar, Saliza Azlina Osman

The surface finish is an essential step in printed circuit boards design because it provides a solderable surface for electronic components. The purpose of this study to…

An experimental study of carbonyl powder power inductor cracking during reflow process

Faisal Rehman, Rafiq Asghar, Kashif Iqbal, Ali Aman, Agha Ali Nawaz

In surface mount assembly (SMA) process, small components are subjected to high temperature variations, which result in components’ deformation and cracking. Because of this…

Property of Sn-37Pb solder bumps with different diameter during thermal shock

Guisheng Gan, Donghua Yang, Yi-ping Wu, Xin Liu, Pengfei Sun, Daquan Xia, Huadong Cao, Liujie Jiang, Mizhe Tian

The impact strength of solder joint under high strain rate was evaluated by board level test method. However, the impact shear test of single solder bump was more convenient and…

An investigation on function of current type on solder joint degradation in electronic packages

Wenhui Cai, Fei Huang, Kai Liu, Mohammed Alaazim

As in real applications several alternating current (AC) currents may be injected to the electronic devices, this study aims to analyze their effects on the lifetime of the solder…

Spatial analysis of underfill flow in flip-chip encapsulation

Fei Chong Ng, Mohd Hafiz Zawawi, Mohamad Aizat Abas

The purpose of the study is to investigate the spatial aspects of underfill flow during the flip-chip encapsulation process, for instance, meniscus evolution and contact line jump…

Application of multi-quality parameter design in the optimization of underfilling process – a case study of a vehicle electronic module

Chien-Yi Huang, Li-Cheng Shen, Ting-Hsuan Wu, Christopher Greene

This paper aims to discuss the key factors affecting the quality characteristics, such as the number of solder balls, the spread distance of residual underfill and the completion…