Table of contents
Activities during melting and reflowing behaviour of solders
J. Mittal, K.L. LinThe purpose of this paper is to visualise the activities of three solders; Sn‐37Pb, Sn‐9Zn and Sn‐3.5Ag on Cu substrates during reflow near their melting points and to relate them…
Effect of stand‐off height on the microstructure and mechanical behaviour of solder joints
Bo Wang, Fengshun Wu, Yiping Wu, Hui Liu, Longzao Zhou, Yuebo FangThe purpose of this paper is to investigate the effect of stand‐off height (SOH) on the microstructure and mechanical behaviour of the solder joints in high density…
Solidification and wetting behaviour of SnAgCu solder alloyed by reactive metal organic flux
Patrick Zerrer, Andreas Fix, Matthias Hutter, Herbert ReichlThe purpose of this paper is to develop a new alloying method for solders by using a metal organic modified flux in solder pastes.
X‐ray solder alloy volume measurement (XSVM) in pin‐in‐paste technology (PIP)
Mihály Janóczki, László JakabThe purpose of this paper is to develop a novel automatic and accurate measurement technique for the volume of solder which is present in solder paste in pin‐in‐paste (PIP…
Moisture effects on adhesion of non‐conductive adhesive attachments
Kirsi Saarinen, Pekka HeinoPersonal and portable electronic devices are becoming an important part of the everyday lives. Electronics miniaturization has been and continues to be the most important driver…
An experimental methodology for the study of co‐planarity variation effects in anisotropic conductive adhesive assemblies
Guangbin Dou, David C. Whalley, Changqing Liu, Y.C. ChanNon‐planarity of assemblies and co‐planarity variation effects on anisotropic conductive adhesive (ACA) assemblies have been a concern for ACA users since the materials are first…
Tin pest in lead‐containing solders
W.J. PlumbridgeThe purpose of this paper is to describe the effects of mechanical testing and thermal treatment prior to storage at either −18 or −40°C, for periods in excess of ten years on the…
ISSN:
0954-0911e-ISSN:
1758-6836ISSN-L:
0954-0911Online date, start – end:
1989Copyright Holder:
Emerald Publishing LimitedOpen Access:
hybridEditors:
- Professor Peng He
- Associate Professor Shuye Zhang