Table of contents
An investigation into the rheological properties of different lead‐free solder pastes for surface mount applications
S. Mallik, N.N. Ekere, R. Durairaj, A.E. MarksThe purpose of this paper is to investigate the rheological behaviour of three different lead‐free solder pastes used for surface mount applications in the electronic industry.
948
Design, materials, and assembly process of high‐density packages with a low‐temperature lead‐free solder (SnBiAg)
John Lau, Jerry Gleason, Valeska Schroeder, Gregory Henshall, Walter Dauksher, Bob SullivanThe purpose of this paper is to discuss the design, materials, and assembly process aspects of a study, conducted by The High Density Packaging Users Group Consortium, into…
628
Reliability test and failure analysis of high‐density packages assembled with a low‐temperature lead‐free solder (SnBiAg)
John Lau, Jerry Gleason, Valeska Schroeder, Gregory Henshall, Walter Dauksher, Bob SullivanThe High Density Packaging Users Group Consortium has conducted a study of process development and solder‐joint reliability of high‐density packages on printed circuit boards…
480
Reliability study of surface mount printed circuit board assemblies with lead‐free solder joints
Jeffery C.C. Lo, B.F. Jia, Z. Liu, J. Zhu, S.W. Ricky LeeThe purpose of this paper is to evaluate the lead‐free solder joint reliability of a variety of surface mount components assembled onto printed circuit boards (PCBs) under a…
631
ISSN:
0954-0911e-ISSN:
1758-6836ISSN-L:
0954-0911Online date, start – end:
1989Copyright Holder:
Emerald Publishing LimitedOpen Access:
hybridEditors:
- Professor Peng He
- Associate Professor Shuye Zhang