Soldering & Surface Mount Technology: Volume 19 Issue 3

Reduced temperature soldering of capacitors using Sn‐Bi plated Sn‐3.5%Ag

Mi Jin Kim, Y. (Norman) Zhou, Jae Pil Jung

This paper seeks to decrease the soldering temperature of capacitors using Sn‐Bi plated Sn‐3.5 wt%Ag solder.

The evolution of paste pressure during stencil printing

David J. Clements, Marc P.Y. Desmulliez, Eitan Abraham

The objective of this investigation is the derivation of a mathematical model that describes the pressure characteristics of paste during the stencil printing process. This model…

Interfacial reactions between Sn‐based solders and AgPt thick film metallizations on LTCC

Olli Nousiainen, Tero Kangasvieri, Kari Rönkä, Risto Rautioaho, Jouko Vähäkangas

This paper aims to investigate the metallurgical reactions between two commercial AgPt thick films used as a solder land on a low temperature co‐fired ceramic (LTCC) module and…

Multiphysics simulation of microwave curing in micro‐electronics packaging applications

T. Tilford, K.I. Sinclair, C. Bailey, M.P.Y. Desmulliez, G. Goussettis, A.K. Parrott, A.J. Sangster

This paper aims to present an open‐ended microwave curing system for microelectronics components and a numerical analysis framework for virtual testing and prototyping of the…

Siplace D2 and D1: new Siemens placement machines for electronics manufacturers with medium-sized volumes and the highest quality requirements

BPM Microsystems display the next generation of the Helix Automated Device Programmer at Nepcon UK 2007

NEPCON 2007 National Exhibition Centre, Birmingham, 14-16 May 2007

J. H. Ling

Siplace Maintenance Manager: The right maintenance at the right time – for any line component

IONMET – new ionic liquid solvent technology to transform metal finishing

Pete Starkey

Portable, localised fume extractor for improved productivity

Advanced directory solves the problems of solder stencil efficiency

New valves from Intertronics dispense micro-dots in all viscosities

RMD Instruments LeadTracer- RoHS XRF shown at Nepcon UK

EIPC/IPC Executive Market and Technology Forum Conference, Copenhagen, 11 and 12 October 2007

Martin Goosey

Assembléon's latest A-Series pick and place machine handles a very wide component range with 20 micron accuracy

RoHS reliability – success or failure?

Assembléon partners with HIN to strengthen sales and service in Denmark