Soldering & Surface Mount Technology: Volume 25 Issue 1

The effect of micro via‐in pad design on surface‐mount assembly defects: part II – voiding and spattering

Yong‐Won Lee, Keun‐Soo Kim, Katsuaki Suganuma

The purpose of this paper is to propose a solution procedure to minimize/eliminate voiding and spattering defects in the assembly of 0201 chip components with micro via‐in pads…

Interfacial reaction of a Sn‐3.0Ag‐0.5Cu thin film during solder reflow

Liu Mei Lee, Habsah Haliman, Ahmad Azmin Mohamad

The purpose of this paper is to produce and investigate the interfacial reaction between Sn‐3.0Ag‐0.5Cu (SAC305) thin films and Cu substrates by solder reflow at various…

Solder joint degradation and detection using RF impedance analysis

Yao Bin, Lu Yudong, Wan Ming

The purpose of this paper is to clarify the method of using RF impedance changes as an early indicator of degradation of solder joint. It proposes the mode of crack propagation in…

Solidification and reliability of lead‐free solder interconnection

Hao Yu, Dongkai Shangguan

As a literature review article, the purpose of this paper is to highlight the intricate interaction and correlation between the interconnection microstructure and the failure…

Surface oxide analysis of lead‐free solder particles

Xin Luo, Wenhui Du, Xiuzhen Lu, Toshikazu Yamaguchi, Gavin Jackson, Li lei Ye, Johan Liu

The composition and thickness of surface oxide of solder particles is extremely important to the quality of interconnect and reliability of packaged system. The purpose of this…

Fluidic aligned, dense SWNTs arrays as potential die adhesive and thermal interface material

Hao Rong, Baoming Wang, Wei‐Qing Lin, Lichao Sun, Jin‐Cheng Zheng, Miao Lu

The purpose of this paper is to report a simple, room temperature approach to assemble dense, vertically aligned single‐walled carbon nanotubes (SWNTs) between a chip and its…