Soldering & Surface Mount Technology: Volume 28 Issue 2

Thermo-mechanical challenges of reflowed lead-free solder joints in surface mount components: a review

Chun Sean Lau, C.Y. Khor, D. Soares, J.C. Teixeira, M.Z. Abdullah

The purpose of the present study was to review the thermo-mechanical challenges of reflowed lead-free solder joints in surface mount components (SMCs). The topics of the review…

A grey-ANN approach for optimizing the QFN component assembly process for smart phone application

Chien-Yi Huang, Ching-Hsiang Chen, Yueh-Hsun Lin

This paper aims to propose an innovative parametric design for artificial neural network (ANN) modeling for the multi-quality function problem to determine the optimal process…

Fabrication and characterization of Cu-Sn-Ni-Cu interconnection microstructure for electromigration studies in 3D integration

Ming Xiao, Walid Madhat Munief, Fengshun Wu, Rainer Lilischkis, Tobias Oberbillig, Monika Saumer, Weisheng Xia

The purpose of this paper is to fabricate a new Cu-Sn-Ni-Cu interconnection microstructure for electromigration studies in 3D integration.

An investigation of microstructure and properties of Sn3.0Ag0.5Cu-XAl2O3 composite solder

Guang Chen, Bomin Huang, Hui Liu, Y.C. Chan, Zirong Tang, Fengshun Wu

The purpose of this paper is to investigate microstructure and properties of Sn3.0Ag0.5Cu-XAl₂O₃ composite solder which were prepared through powder metallurgy route.

Effect of Sb on wetting behavior of near eutectic Sn-Cu solder micro-alloyed with Ni and Ge

Amir Hossein Nobari, Mehran Maalekian, Karl Seelig, Mihriban Pekguleryuz

The purpose of this paper is to investigate the effect of Sb (0, 0.2 and 2 wt.%) on wetting performance of lead-free solder of near eutectic Sn-Cu micro-alloyed with Ni and Ge.

Time-based reflow soldering optimization by using adaptive Kriging-HDMR method

Liming Chen, Enying Li, Hu Wang

Reflow soldering process is an important step of the surface mount technology. The purpose of this paper is to minimize the maximum warpage of shielding frame by controlling…

Compressive sensing for noisy solder joint imagery based on convex optimization

Huihuang Zhao, Jianzhen Chen, Shibiao Xu, Ying Wang, Zhijun Qiao

The purpose of this paper is to develop a compressive sensing (CS) algorithm for noisy solder joint imagery compression and recovery. A fast gradient-based compressive sensing…