Thermo-mechanical challenges of reflowed lead-free solder joints in surface mount components: a review

Abstract

Purpose

The purpose of the present study was to review the thermo-mechanical challenges of reflowed lead-free solder joints in surface mount components (SMCs). The topics of the review include challenges in modelling of the reflow soldering process, optimization and the future challenges in the reflow soldering process. Besides, the numerical approach of lead-free solder reliability is also discussed.

Design/methodology/approach

Lead-free reflow soldering is one of the most significant processes in the development of surface mount technology, especially toward the miniaturization of the advanced SMCs package. The challenges lead to more complex thermal responses when the PCB assembly passes through the reflow oven. The virtual modelling tools facilitate the modelling and simulation of the lead-free reflow process, which provide more data and clear visualization on the particular process.

Findings

With the growing trend of computer power and software capability, the multidisciplinary simulation, such as the temperature and thermal stress of lead-free SMCs, under the influenced of a specific process atmosphere can be provided. A simulation modelling technique for the thermal response and flow field prediction of a reflow process is cost-effective and has greatly helped the engineer to eliminate guesswork. Besides, simulated-based optimization methods of the reflow process have gained popularity because of them being economical and have reduced time-consumption, and these provide more information compared to the experimental hardware. The advantages and disadvantages of the simulation modelling in the reflow soldering process are also briefly discussed.

Practical implications

This literature review provides the engineers and researchers with a profound understanding of the thermo-mechanical challenges of reflowed lead-free solder joints in SMCs and the challenges of simulation modelling in the reflow process.

Originality/value

The unique challenges in solder joint reliability, and direction of future research in reflow process were identified to clarify the solutions to solve lead-free reliability issues in the electronics manufacturing industry.

Citation

Lau, C.S., Khor, C.Y., Soares, D., Teixeira, J.C. and Abdullah, M.Z. (2016), "Thermo-mechanical challenges of reflowed lead-free solder joints in surface mount components: a review", Soldering & Surface Mount Technology, Vol. 28 No. 2, pp. 41-62. https://doi.org/10.1108/SSMT-10-2015-0032