Soldering & Surface Mount Technology: Volume 28 Issue 3

A review: lead free solder and its wettability properties

Ervina Efzan Mhd Noor, Nur Faziera Mhd Nasir, Siti Rabiatul Aisya Idris

The purpose of this paper is to publish on the review of the lead free solder for electronic packaging. This involved the basic principles of the solder, the lead solder and its…

Wettability and spreadability study of molten Sn-3.0Ag-0.5Cu wetting on V-shaped substrate

Bingsheng Xu, Yan Wu, Lina Zhang, Junwei Chen, Zhangfu Yuan

This research aims to provide a theoretical method and data supports for a future study on interfacial reaction mechanism and spreading mechanism between molten solder and…

Intermetallic growth and shear strength of SAC305/EN-Boron

Hardinnawirda Kahar, Zetty Akhtar Abd Malek, Siti Rabiatull Aisha Idris, Mahadzir Ishak

This paper aims to study the effect of aging and cooling rate on the reliability of the solder joint using electroless nickel boron (EN-Boron) as a surface finish in the…

Direct bonding of silicon with solders type Sn-Ag-Ti

Roman Kolenak, Igor Kostolný, Martin Sahul

The work aims to study the direct bonding of silicon substrate with solders type Sn-Ag-Ti.

Retained ratio of reinforcement in SAC305 composite solder joints: effect of reinforcement type, processing and reflow cycle

Guang Chen, Li Liu, Vadim V. Silberschmidt, Y.C. Chan, Changqing Liu, Fengshun Wu

This paper aims to systematically study the effect of reinforcement type, processing methods and reflow cycle on actual retained ratio of foreign reinforcement added in solder…

High temperature creep properties of low-Ag Cu/Sn-Ag-Cu-Bi-Ni/Cu solder joints by nanoindentation method

Xiangxia Kong, F. Sun, Miaosen Yang, Yang Liu

This paper aims to investigate the creep properties of the bulks of low-Ag Cu/Sn-Ag-Cu-Bi-Ni/Cu micro solder joints from 298 to 358 K. The creep constitutive modelling was…