Soldering & Surface Mount Technology: Volume 31 Issue 4

Mechanical property and reliability of bimodal nano-silver paste with Ag-coated SiC particles

Qiaoran Zhang, Abdelhafid Zehri, Jiawen Liu, Wei Ke, Shirong Huang, Martí Gutierrez Latorre, Nan Wang, Xiuzhen Lu, Cheng Zhou, Weijuan Xia, Yanpei Wu, Lilei Ye, Johan Liu

This study aims to develop a bimodal nano-silver paste with improved mechanical property and reliability. Silicon carbide (SiC) particles coated with Ag were introduced in…

Failure analysis on cracking of blind and buried vias of printed circuit board for high-end mobile phones

Jie Tang, Yi Gong, Zhen-Guo Yang

The submitted paper is mainly concerned with the cracking of blind and buried vias of printed circuit board (PCB) for smartphones which were encountered with abnormal display…

Investigation of anodic dissolution behaviour of intermetallic compound in Sn-3Ag-0.5Cu solder alloy by cyclic voltammetry

Ibrahym Ahmad, Anasyida Abu Seman, Ahmad Azmin Mohamad

The purpose of this paper is to study the mechanism of electrochemical dissolution of SAC305 solder in mild acid solution.

Transient liquid phase bonding in the Cu-Sn system

Behnam Hosseinzaei, Ali Reza Kiani Rashid

This paper aims to study the features of microstructures and mechanical properties of the joints which were produced by transient liquid phase method. The difference between…

Microstructure evolution and growth behavior of Cu/SAC105/Cu joints soldered by thermo-compression bonding

Mengjiao Guo, F. Sun, Zuozhu Yin

This paper used a novel technique, which is thermo-compression bonding, and Sn-1.0Ag-0.5Cu solder to form a full intermetallic compound (IMC) Cu₃Sn joints (Cu/Cu₃Sn/Cu joints)…

A method for optimizing stencil cleaning time in solder paste printing process

JiangYou Yu, Le Cao, Hao Fu, Jun Guo

Stencil cleaning is an important operation in solder paste printing process. Frequent cleaning may interrupt printing process and increase idle time, as well as loss for…

Study on the strength of diameter-reducing solder balls by shear and pull tests

Kehang Yu, Chen Yang, Jun Wang, Jiabo Yu, Yi Yang

The purpose of this paper is to study the variation of the mechanical strength and failure modes of solder balls with reducing diameters under conditions of multiple reflows.

Performance of SAC305 and SAC305-0.4La lead free electronic solders at high temperature

Muhammad Aamir, Majid Tolouei-Rad, Israr Ud Din, Khaled Giasin, Ana Vafadar

Tin-Silver-Copper is widely accepted as the best alternative to replace Tin-Lead solders in microelectronics packaging due to their acceptable properties. However, to overcome…

The study on reliability of Ni-coated graphene doped SAC305 lead-free composite solders under high current-density stressing

Guang Chen, Jiqiang Li, Xinwen Kuang, Yaofeng Wu, Fengshun Wu

The purpose of this paper is to investigate the effect of nickel-plated graphene (Ni-GNS) on the microstructure and mechanical properties of 96.5Sn3Ag0.5Cu (SAC305) lead-free…

Applying data mining methodology to establish an intelligent decision system for PCBA process

Chien-Yi Huang, Marvin Ruano, Ching-Hsiang Chen, Christopher Greene

This paper aims to consider the practical production environment of electronics manufacturing industry firms, and the large quantities of information collected on machine…