Soldering & Surface Mount Technology: Volume 8 Issue 3

SMT Stencil Cleaning – A Decision that Could Affect Production

R.S. Clouthier

SMT stencil cleaning has traditionally been thought of as a‘maintenance’ procedure with little or no impact on production. Today, CFC and VOCcleaning processes are being replaced…

Method for Paste Selection and Process Optimisation for Fine‐pitch SMT

D. Gagne, M. Quaglia, S.G. Shina

This paper outlines amethodology of paste selection for fine‐pitch SMT using a sequential investigation processincluding Design of Experiments (DoE) techniques. Several factors…

Effect of Substrate Preheating on Solderability Performance as a Guideline for Assembly Process Development Part 1: Baseline Analysis *

P.T. Vianco, A.C. Claghorn **

A study was performed which investigated the wettability of 63Sn‐37Pb and 96.5Sn‐3.5Ag solders oncopper and gold ‐nickel plated Kovar ™ using a rosin ‐based, mildlyactivated (RMA…

Case Histories of Radiation Curing for Electronic Packaging

P. Swanson

Light radiation cure adhesives, coatings and encapsulants are being used in the electronics manufacturingindustry with increasing frequency because their properties and process…

BGA and CGA Solder Attachments: Results of Low‐acceleration Reliability Test and Analysis *

W. Engelmaier

Highly accelerated tests, while capable of producing failures in short test durations, cancause significant damage and failure as a result of damage mechanisms and/or material…

Mass Soldering

G. Becker

This issue of the journal features the first part of a two‐part serieswhich comprises Chapter 15 from Volume 1 of a recently published book ‘AComprehensive Guide to the…

Printing of SMT Adhesives

A.Z. Miric

SMT adhesives are applied to printed circuit boards by the following techniques: dispensing (c. 90% of all manufacturers use this technique at present), printing and pin transfer…