Soldering & Surface Mount Technology: Volume 35 Issue 3

ZnO nanoparticles and compositional dependence of structural, thermal, mechanical and electrical properties of eutectic SAC355 lead-free solder

Hamed Al-sorory, Mohammed S. Gumaan, Rizk Mostafa Shalaby

This paper aims to summarise the effects of ZnO nanoparticles (0.1, 0.3, 0.5, 0.7 and 1.0 Wt.%) on the structure, mechanical, electrical and thermal stability of Sn–3.5Ag–0.5Cu…

IC solder joint inspection via adaptive statistical modeling

Meng Xiao, Nian Cai, Zhuokun Mo, Shule Yan, Nili Tian, Jing Ma, Han Wang

Statistical modeling has been successfully applied to integrated circuit (IC) solder joint inspection. However, there are some inherent problems in previous statistical modeling…

Properties of Cu/SAC0307 mixed solder balls/Cu joints with different Zn-particles content at low-temperature under ultrasonic assisted

Guisheng Gan, Shiqi Chen, Liujie Jiang, Cong Liu, Tian Huang, Peng Ma, Dayong Cheng, Xin Liu

This study aims to research properties of Cu/SAC0307 mixed solder balls/Cu joints with different Zn-particles content at low-temperature under ultrasonic assisted.

Influence of aging temperature on the properties of Cu/(SAC0307 powder +Zn-particles)/Al joints ultrasonic-assisted soldered at low temperature

Guisheng Gan, Shiqi Chen, Liujie Jiang, Qianzhu Xu, Tian Huang, Dayong Cheng, Xin Liu

This study aims to evaluate the effect of thermal aging temperature on the properties of Cu/Al joints.

Numerical modelling of the delamination in multi-layered ceramic capacitor during the thermal reflow process

Fei Chong Ng, Aizat Abas, Mohamad Riduwan Ramli, Mohamad Fikri Mohd Sharif, Fakhrozi Che Ani

This paper aims to study the interfacial delamination found in the boundary of the copper/copper-epoxy layers of a multi-layer ceramic capacitor.

A review: effect of copper percentage solder alloy after laser soldering

Asyraf Abdullah, Siti Rabiatull Aisha Idris

This study aims to review the effect of copper percentage in Sn-based solder alloys (Sn-xCu, x = 0–5 Wt.%) on intermetallic compound (IMC) formation and growth after laser…