Soldering & Surface Mount Technology: Volume 3 Issue 1

ESCA Analysis of Ageing of Metallic Surfaces: Solderability of Nickel Silver

J.L. Marshall, D.E. Miiller

Because of recent interest in nickel silver (copper‐zinc‐nickel alloy) in electronic applications, this alloy was chosen for an ageing‐solderability study. An Auger/ESCA study was…

Quantitative Solderability Measurement of Electronic Components: Part 5: Wetting Balance Instrumental Parameters and Procedures

C. Lea

The wetting balance has been identified as a technique suitable for the establishment of a quantitative basis for the measurement of the solderability of electronic components…

Substitution of CFC‐113 in Developing Nations

B.N. Ellis

Developed nations have problems converting from chlorofluorocarbon solvents to non‐polluting cleaning methods. This problem is amplified in developing nations which could have…

The Effect of Ageing on the Microstructure of 60:40 Tin‐lead Solders

P.G. Harris, K.S. Chaggar, M.A. Whitmore

Studies have been made of ageing effects, both at room temperature and at 125°C, on the microstructure of 60:40 tin‐lead solders. A comparison was made of the effect of ageing on…

Impurities in Solder—Their Impact on Solderability and Corrosion

G. Becker

German silver was tinned at three temperatures with solder containing 17 different impurities at up to five different concentration levels. The tinning process was carried out in…

Stress‐rupture and Creep Behaviour of 63Sn‐37Pb Production Soldered Connections

J. Seyyedi, B. Arsenault, J.P. Keller

Quasi shear and tensile mode stress‐rupture and quasi shear mode creep behaviours were investigated for aged production surface mount soldered connections of 127 mm pitch, rigid…

Special reports

The title of this report can be translated as ‘Let Singapore Flourish’. The Singapore Government is probably doing more than at least 90% of the other governments of the world…

SMART group news

The popular reflow day was repeated at Henley and commenced with Mike Judd giving an overview of current reflow techniques.

International association news

Although the subject discussed at this meeting is one in which I have a personal and commercial interest, I will try to report the meeting in an unbiased manner. I must, however…

Industry news

Paul Davis has been appointed Sales Engineer with Alpha Metals, suppliers of solder products and related materials to the electronics industry. Born and bred in Stockton, he…

New Products

Pace Inc.'s MBT 250 is a microprocessor controlled assembly and repair system for surface mount and through‐hole applications which can proportionally power up to three handpieces…