Soldering & Surface Mount Technology: Volume 34 Issue 1

Electronic component detection based on image sample generation

Hao Wu, Quanquan Lv, Jiankang Yang, Xiaodong Yan, Xiangrong Xu

This paper aims to propose a deep learning model that can be used to expand the number of samples. In the process of manufacturing and assembling electronic components on the…

Accurate composition dependent thermo mechanical lifetime estimation of hour glass type solder joint in electronic assemblies

Leonid Anatolevich Olenev, Rafina Rafkatovna Zakieva, Nina Nikolaevna Smirnova, Rustem Adamovich Shichiyakh, Kirill Aleksandrovich Ershov, Nisith Geetha

This study aims to present a more accurate lifetime prediction model considering solder chemical composition.

Experimental measurements of the shear force on surface mount components simulating the wave soldering process

Violeta Carvalho, Bruno Arcipreste, Delfim Soares, Luís Ribas, Nelson Rodrigues, Senhorinha Teixeira, José C. Teixeira

This study aims to determine the minimum force required to pull out a surface mount component in printed circuit boards (PCBs) during the wave soldering process through both…

Local solidification thermal parameters affecting the eutectic extent in Sn-Cu and Sn-Bi solder alloys

Rafael Kakitani, Cassio Augusto Pinto da Silva, Bismarck Silva, Amauri Garcia, Noé Cheung, José Eduardo Spinelli

Overall, selection maps about the extent of the eutectic growth projects the solidification velocities leading to given microstructures. This is because of limitations of most of…

Effect of microwave operating power and reflow time on the microstructure and tensile properties of Sn–3.0Ag–0.5Cu/Cu solder joints

Mardiana Said, Muhammad Firdaus Mohd Nazeri, Nurulakmal Mohd Sharif, Ahmad Azmin Mohamad

This paper aims to investigate the morphology and tensile properties of SAC305 solder alloy under the influence of microwave hybrid heating (MHH) for soldering at different…

Model updating of a temperature field simulation of a printed circuit board assembly based on the Kriging model

Yutian Yin, Hongda Zhou, Cai Chen, Yi Zheng, Hongqiao Shen, Yubing Gong

The simulated temperature profile of the printed circuit board assembly (PCBA) during reflow soldering process deviates from the actual profile. To reduce this relative deviation…

Reliability modeling and assessment of solder joints of electronic assemblies under mixed exposure to mechanical loads

  Supriyono, Tzu-Chia Chen, Lis M. Yapanto, Zagir Azgarovich Latipov, Angelina Olegovna Zekiy, Lyubov A. Melnikova, Lakshmi Thangavelu, A. Surendar, Nikolay I. Repnikov, Zeinab Arzehgar

In this paper, a lifetime estimation model for the solder joint is proposed which is capable of considering both severe and running mechanical shocks which is the real case in…