Soldering & Surface Mount Technology: Volume 8 Issue 2

Fluxless Flip‐chip Bonding on Flexible Substrates: A Comparison between Adhesive Bonding and Soldering*

R. Aschenbrenner, E. Zakel, G. Azdasht**, A. Kloeser, H. Reichl

During the last few years an increasing number of flip‐chip (FC) interconnection technologies have emerged. While flip‐chip assembly offers many advantages compared with…

Novel Application of Diffusion Soldering*

D.M. Jacobson, S.P.S Sangha

The comparatively new process of diffusion soldering combines themerits of Soldering and diffusion bonding. It is tolerant to surfaces that are not perfectly flat while, at…

Advantages of Protective Atmosphere Control for No‐Clean Solder Pastes*

F.J. de Klein

Reflow soldering in a controlled O₂ atmosphere will lead to practical benefits in the wettingbehaviour of solder pastes. The required O₂ level and its control depend on the…

Screen Printing is a Science, not an Art

D. Mc Phail

In a production environment, the first process applied to a bareprinted circuit board is generally the application of solder paste. It has been reported that 60% of allrework is…

Reliability Evaluation of TSOP Solder Joints for PC Card Application

J. Seyyedi, R. lannuzzelli, J. Bukhari

As part of the portable product interconnects characterisation programme, the present investigation was conducted to determine the attachment integrity andlong‐term reliability of…

Intercomparison Results of a Gold Plated Nickel Solderability Reference Standard

C. Hunt

The development and characterisation of a prototype solderability reference standard basedon a gold‐plated nickel sample has been described previously. This material has nowbeen…