Soldering & Surface Mount Technology: Volume 30 Issue 1

SAC–xTiO2 nano-reinforced lead-free solder joint characterizations in ultra-fine package assembly

Fakhrozi Che Ani, Azman Jalar, Abdullah Aziz Saad, Chu Yee Khor, Roslina Ismail, Zuraihana Bachok, Mohamad Aizat Abas, Norinsan Kamil Othman

This paper aims to investigate the characteristics of ultra-fine lead-free solder joints reinforced with TiO₂ nanoparticles in an electronic assembly.

Morphology transformation on Cu3Sn grains during the formation of full Cu3Sn solder joints in electronic packaging

Peng Yao, Xiaoyan Li, Fengyang Jin, Yang Li

This paper aims to analyze the morphology transformation on the Cu₃Sn grains during the formation of full Cu₃Sn solder joints in electronic packaging.

A study on the effect of electromigration on solder alloy joint on copper with nickel surface finish

Ervina Efzan Mhd Noor, Baaljinder R., Emerson J.

The purpose of this study is to investigate the effect of electromigration (EM) on solder alloy joint on copper with nickel surface finish. Sn-Bi solder alloy has been used in…

Stable interconnections for LTCC micro-heater using isothermal solidification technique

Duguta Suresh Kumar, Nikhil Suri, P.K. Khanna

The purpose of this work is to explore the forms of intermetallic phase compounds (IMPCs) in Pt/In/Au and Pt/In/Ag joints by using isothermal solidification. This lead-free…

Lead-free solder wettability of oxidized-aluminum enhanced by Ar-H2 plasmas for flip-chip bumping

Yung-Sen Lin, Shiau-Min Lin, Jian-Yi Li, Min-Chih Liao

An investigation has been performed on the improved solder wettability of oxidized aluminum (Al) with lead-free solder (96.5Sn-3.5Ag) using Ar-H₂ plasmas. The lead-free solder…

Failure analysis of solder layer in power transistor

Maogong Jiang, Guicui Fu, Bo Wan, Peng Xue, Yao Qiu, Yanruoyue Li

The purpose of this paper is to present a failure analysis of the solder layer in a Darlington power transistor in a TO-3 package.

Rheological characterization of non-Brownian suspensions based on structure kinetics

Kurian J. Vachaparambil, Gustaf Mårtensson, Lars Essén

The purpose of the paper is to develop a methodology to characterize the rheological behaviour of macroscopic non-Brownian suspensions, like solder paste, based on microstructural…