SAC–xTiO2 nano-reinforced lead-free solder joint characterizations in ultra-fine package assembly
Soldering & Surface Mount Technology
ISSN: 0954-0911
Article publication date: 9 January 2018
Issue publication date: 23 January 2018
Abstract
Purpose
This paper aims to investigate the characteristics of ultra-fine lead-free solder joints reinforced with TiO2 nanoparticles in an electronic assembly.
Design/methodology/approach
This study focused on the microstructure and quality of solder joints. Various percentages of TiO2 nanoparticles were mixed with a lead-free Sn-3.5Ag-0.7Cu solder paste. This new form of nano-reinforced lead-free solder paste was used to assemble a miniature package consisting of an ultra-fine capacitor on a printed circuit board by means of a reflow soldering process. The microstructure and the fillet height were investigated using a focused ion beam, a high-resolution transmission electron microscope system equipped with an energy dispersive X-ray spectrometer (EDS), and a field emission scanning electron microscope coupled with an EDS and X-ray diffraction machine.
Findings
The experimental results revealed that the intermetallic compound with the lowest thickness was produced by the nano-reinforced solder with a TiO2 content of 0.05 Wt.%. Increasing the TiO2 content to 0.15 Wt.% led to an improvement in the fillet height. The characteristics of the solder joint fulfilled the reliability requirements of the IPC standards.
Practical implications
This study provides engineers with a profound understanding of the characteristics of ultra-fine nano-reinforced solder joint packages in the microelectronics industry.
Originality/value
The findings are expected to provide proper guidelines and references with regard to the manufacture of miniaturized electronic packages. This study also explored the effects of TiO2 on the microstructure and the fillet height of ultra-fine capacitors.
Keywords
Acknowledgements
The authors would like to thank the Universiti Kebangsaan Malaysia (Research grant–DIP-2014-012), Universiti Sains Malaysia (304/PMEKANIK/60312038) and Jabil Circuit Sdn Bhd for their financial support.
Citation
Che Ani, F., Jalar, A., Saad, A.A., Khor, C.Y., Ismail, R., Bachok, Z., Abas, M.A. and Othman, N.K. (2020), "SAC–xTiO2 nano-reinforced lead-free solder joint characterizations in ultra-fine package assembly", Soldering & Surface Mount Technology, Vol. 30 No. 1, pp. 1-13. https://doi.org/10.1108/SSMT-04-2017-0011
Publisher
:Emerald Publishing Limited
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