Soldering & Surface Mount Technology: Volume 31 Issue 3

Guest editorial

Agata Skwarek

Vapour phase soldering (VPS) technology: a review

Balázs Illés, Attila Géczy, Bálint Medgyes, Gábor Harsányi

This paper aims to present a review of the recent developments in vapour phase soldering (VPS) technology. This study focuses on the following topics: recent developments of the…

Measurement and regulation of saturated vapour height level in VPS chamber

Lubomir Livovsky, Alena Pietrikova

The purpose of this paper is to investigate measurement and regulation of saturated vapour height level in vapour phase soldering (VPS) chamber based on parallel plate capacitor…

Machine learning-based prediction of component self-alignment in vapour phase and infrared soldering

Oliver Krammer, Péter Martinek, Balazs Illes, László Jakab

This paper aims to investigate the self-alignment of 0603 size (1.5 × 0.75 mm) chip resistors, which were soldered by infrared or vapour phase soldering. The results were used for…

Advances in pressure sensing for vapour phase soldering process monitoring

Mohamed Amine Alaya, Attila Geczy, Balazs Illes, Gábor Harsányi, David Bušek

The purpose of the paper is to improve the control of vapour phase soldering (VPS). To enable better productivity and assembling quality, the industry needs to provide precise…

Non-Newtonian numerical modelling of solder paste viscosity measurement

Tareq I. Al-Ma’aiteh, Oliver Krammer

The purpose of this paper is to present the establishment of a computational fluid dynamics model for investigating different non-Newtonian rheological models of solder pastes by…

Experimental approach to thermal conductivity of macro solder joints with voids

Maciej Sobolewski, Barbara Dziurdzia

The purpose of the paper is to experimentally evaluate the impact of voids on thermal conductivity of a macro solder joint formed between a copper cylinder and a copper plate by…