Table of contents - Special Issue: Computational modelling technology
Correlation of solder paste rheology with computational simulations of the stencil printing process
R. Durairaj, G.J. Jackson, N.N. Ekere, G. Glinski, C. BaileySoldering technologies continue to evolve to meet the demands of the continuous miniaturisation of electronic products, particularly in the area of solder paste formulations used…
Solder paste reflow modeling
S.H. MannanSolder paste printing and reflow are well established processes for producing solder joints in electronic assemblies. Solder paste consists of a dense suspension of solder…
Numerical modelling of scanned beam laser soldering of fine pitch packages
P.M. Beckett, A.R. Fleming, J.M. Gilbert, D.G. WhiteheadLaser soldering provides a useful tool for the electronics manufacturer and has found a number of successful industrial applications. The laser provides highly controllable…
A simplified model of the reflow soldering process
David C. Whalley, Stuart M. HyslopPrevious models of temperature development during the reflow soldering process have typically used commercially available, general purpose, finite difference/finite element…
CFD modelling of the flow field inside a reflow oven
Hao Yu, Jorma KivilathtiBecause of new requirements related to the employment of lead‐free manufacturing and the diversity of components and metal finishes on high density printed circuit boards, better…
Analysis on solder ball shear testing conditions with a simple computational model
S.W. Ricky Lee, Xingjia HuangThis paper introduces a simple computational model for the analysis on the solder ball shear testing conditions. Both two‐dimensional (2‐D) and three‐dimensional (3‐D) finite…
Optimisation modelling for flip‐chip solder joint reliability
S. Stoyanov, C. Bailey, M. CrossThis paper details and demonstrates integrated optimisation‐reliability modelling for predicting the performance of solder joints in electronic packaging. This integrated…
ISSN:
0954-0911e-ISSN:
1758-6836ISSN-L:
0954-0911Online date, start – end:
1989Copyright Holder:
Emerald Publishing LimitedOpen Access:
hybridEditors:
- Professor Peng He
- Associate Professor Shuye Zhang