Table of contents
Effect of strain on whisker growth in matte tin
A.R. Southworth, C.E. Ho, A. Lee, K.N. SubramanianTo evaluate the role of imposed strain on whisker growth in matte tin, and to identify the appropriate deformation states and environments that will facilitate the development of…
305
Effect of interconnection area on shear strength of sintered joint with nano‐silver paste
Kun Qi, Xu Chen, Guo‐Quan LuTraditional chip‐level interconnection materials show many weaknesses given the development trend of microelectronic packaging technology. In order to meet the needs of…
824
Microstructural changes of lead‐free solder joints during long‐term ageing, thermal cycling and vibration fatigue
Andreas R. Fix, Wolfgang Nüchter, Jürgen WildeThe purpose of this paper is to investigate the microstructural development of SnAgCu solder joints under different loading conditions (isothermal storage, thermal cycling and…
1913
Effect of Ag content on wetting properties and solidus temperature of Sn‐8.5Zn‐xAg‐0.01Al‐0.1Ga lead‐free solders
R.S. Lai, K.L. Lin, B. SalamTo study the effect of Ag content on the melting temperature and wetting properties of Sn‐8.5Zn‐xAg‐0.01Al‐0.1Ga lead‐free Solders.
274
ISSN:
0954-0911e-ISSN:
1758-6836ISSN-L:
0954-0911Online date, start – end:
1989Copyright Holder:
Emerald Publishing LimitedOpen Access:
hybridEditors:
- Professor Peng He
- Associate Professor Shuye Zhang