Soldering & Surface Mount Technology: Volume 34 Issue 4

Analytical and numerical analyses of filling progression and void formation in flip-chip underfill encapsulation process

Fei Chong Ng, Aizat Abas, Muhammad Naqib Nashrudin, M. Yusuf Tura Ali

This paper aims to study the filling progression of underfill flow and void formation during the flip-chip encapsulation process.

Investigation of solder beading phenomenon under surface-mounted electrolytic capacitors

Daniel Straubinger, Attila Toth, Viktor Kerek, Zsolt Czeczei, Andras Szabo, Attila Geczy

The purpose of this paper is to study the solder beading phenomenon (referring to larger-sized solder balls) of surface-mounted electrolytic capacitors. Solder beading could…

Study of mechanical properties of indium-based solder alloys for cryogenic applications

Madhuri Chandrashekhar Deshpande, Rajesh Chaudhari, Ramesh Narayanan, Harishwar Kale

This study aims to develop indium-based solders for cryogenic applications.

The influence of SACX0307-ZnO nanocomposite solder alloys on the optical and thermal properties of power LEDs

Agata Skwarek, Przemysław Piotr Ptak, Krzysztof Górecki, Krzysztof Witek, Balázs Illés

This paper aims to present the results of investigations that show the influence of ZnO composite soldering paste on the optical and thermal parameters of power light-emitting…

Influence of the soldering paste type on optical and thermal parameters of LED modules

Krzysztof Górecki, Przemysław Ptak, Barbara Dziurdzia

This paper presents the results of the investigations of LED modules soldered with the use of different soldering pastes.

Solder void size reduction in semiconductor package by vacuum reflow and pressure cure processes

Siang Miang Yeo, Ho Kwang Yow, Keat Hoe Yeoh

Semiconductor packaging industry has in recent years tightened the tolerance criteria for acceptable solder void size in the semiconductor packages due to the high usage in…