Soldering & Surface Mount Technology: Volume 28 Issue 4

Analytical and finite element methodology modeling of the thermal management of 3D IC with through silicon via

Mei-Ling Wu, Jia-Shen Lan

This paper aims to develop the thermal resistance network model based on the heat dissipation paths from the multi-die stack to the ambient and takes into account the composite…

Preparation of PEG-rosin derivative for water soluble rosin flux

Kanlaya Phaphon, Sumrit Wacharasindhu, Amorn Petsom

This study aims to synthesize polyethylene glycol (PEG)-rosin derivatives from rosin and PEG for the production of solid soldering fluxes. The PEG-rosin derivatives would be water…

Simulating surface tension of Sn-based lead free solder using an artificial neural network

Min Wu, Xiangyu Su

Because of the complexity of relationship between surface tension and its decisive factors, such as temperature, concentration, electronic density, molar atomic volume and…

IC solder joint inspection based on the Gaussian mixture model

Nian Cai, Qian Ye, Gen Liu, Han Wang, Zhijing Yang

This paper aims to inspect solder joint defects of integrated circuit (IC) components on printed circuit boards. Here, an IC solder joint inspection algorithm is developed based…

Effect of P and Ge doping on microstructure of Sn-0.3Ag-0.7Cu/Ni-P solder joints

Xingchen Yan, Kexin Xu, Junjie Wang, Xicheng Wei, Wurong Wang

The purpose of this paper is to comparatively investigate the microstructure and interfacial intermetallic compound (IMC) layer of Cu/SACPG/Ni and Cu/SAC0307/Ni solder joints…

Investigation of soldering for crystalline silicon solar cells

Hong Yang, He Wang, Dingyue Cao

Tabbing and stringing are the critical process for crystalline silicon solar module production. Because of the mismatch of the thermal expansion coefficients between silicon and…