Soldering & Surface Mount Technology: Volume 7 Issue 2

Technology overview from the president of the surface mount technology association

BRUCE INPYN

While at Surface Mount International in August of 1994, I remember seeing hundreds and hundreds of people intently interested in and focused on the content of the presentations at…

Application Model for Organic Solderability Preservatives

G.M. Wenger, D.A. Machusak, J.L. Parker

Organic solderability preservative (OSP) coatings are not new. They have been used successfully with aggressive water soluble flux for assembly of through‐hole only PWBs. However…

Feasibility of Some Lead‐free Solder Alloys as Filler Materials for Z‐axis Adhesives

P. Savolainen, J. Kivilahti

Polyester connector strips were joined to polyimide substrates with anisotropic electrically conductive adhesives. Copper conductors as well as Au/Ni‐coated copper conductors were…

New Soldering Process Using Light Beam Technology

M. Takagi, T. Yamaji

Today, approximately three years since its development, the non‐contact micro soldering method (local soldering method) continues to be highly regarded due to its superiority over…

Conductive Adhesives: A Critical Review of Progress to Date

P.G. Harris

Conductive adhesives (CAs) have been with us for a number of years and have found use in a variety of applications. More recently pressure from environmentalists has led to a…

Examination of Various Soldered Surfaces and Electronic Components by Confocal Microscopy

P.S. Braterman, J.L. Marshall, J. Sees, C. Tan, J. Zhao

The unique advantages of confocal microscopy are used to explore four cases of interest: (i) voids in solder (depth and surface texture determined), (ii) steam vs ambient aged…

Fine Pitch Surface Mount Technology Assembly with Lead‐free, Low Residue Solder Paste

I. Artaki, A.M. Jackson, P.T. Vianco

Fine pitch (0.4 mm) surface mount assembly studies were conducted with several lead‐free solder pastes formulated with both traditional RMA (∼6% residue level) and low residue…

Lead‐free Solder Pastes Evaluation at Motorola Transmission Products Division

K. Akinade, R. Burgess, M. Campbell, S. Carver, L. Sanderson, R. Wade, C. Melton

The increased interest in the electronics industry to search for alternatives to lead‐containing solders is evidenced by the number of recently published articles on lead‐free…

The Effect of Product Formulation, Substrate Solderability and Reflow Atmosphere on Solder Paste Reflow Performance

M. Warwick, B.S. Chowdhary, N. Stanton

The resin activators' type and quantity in a solder paste have a significant effect on reflow behaviour. These interact with the effects of the oxygen content of the reflow…

Initial and Ongoing Training Requirements

D. Boswell

This paper is a chapter from David Boswell's latest book entitled ‘Setting Up In‐house Surface Mount Technology: Practical Management and Technical Guidelines’, published by…

SMART group news

Gordon Pryor

The SMART Group Aims to Promote the Advancement of the Electronics Manufacturing Industry through the Education, Training and Notification of its Members in Surface Mount and…

Industry news

Assembly & Automation (Electronics) Ltd has recently been acquired by California‐based Flextronics International Limited. Under the terms of the proposed acquisition, Flextronics…

New Products

The ATF 10/20 from Electrovert (UK) is a bench‐top wave soldering system, whose competent ‘no frills’ ease of maintenance design combined with sound build quality makes it an…