Soldering & Surface Mount Technology: Volume 31 Issue 1

Microstructure of Sn-20In-2.8Ag solder and mechanical properties of joint with Cu

Fen Peng, Wensheng Liu, Yunzhu Ma, Chaoping Liang, Yufeng Huang, Siwei Tang

To explore substitutes for traditional Sn-Pb solder, Sn-20In-2.8Ag was considered because of its appropriate melting temperature, good reliability and high ductility at less than…

Shear strength and fracture mechanism for full Cu-Sn IMCs solder joints with different Cu3Sn proportion and joints with conventional interfacial structure in electronic packaging

Peng Yao, Xiaoyan Li, Xu Han, Liufeng Xu

This study aims to analyze the shear strength and fracture mechanism of full Cu-Sn IMCs joints with different Cu₃Sn proportion and joints with the conventional interfacial…

Stress analysis of pressure-assisted sintering for the double-side assembly of power module

Yang Liu, Hao Zhang, Lingen Wang, Xuejun Fan, Guoqi Zhang, F. Sun

Crack and stress distribution on dies are key issues for the pressure-assisted sintering bonding of power modules. The purpose of this research is to build a relationship among…

The effect of vacancy on the interfacial diffusion in Cu/Sn lead-free solder joints

Li Yang, Li Xiaoyan, Peng Yao

The purpose of this paper is to investigate the diffusion behaviors of different atoms at the Cu/Cu3Sn interface and the vacancy formation energy, diffusion energy barrier and…

Nickel effects on the structural and some physical properties of the eutectic Sn-Ag lead-free solder alloy

Mohammed S. Gumaan, Rizk Mostafa Shalaby, Mustafa Kamal Mohammed Yousef, Esmail A.M. Ali, E. E. Abdel-Hady

This study aims to investigate the structural, mechanical, thermal and electrical properties of tin–silver–nickel (Sn-Ag-Ni) melt-spun solder alloys. So, it aims to improve the…

Corrosion characterization of Sn-Zn solder: a review

Muhammad Firdaus Mohd Nazeri, Muhamad Zamri Yahaya, Ali Gursel, Fakhrozi Cheani, Mohamad Najmi Masri, Ahmad Azmin Mohamad

The purpose of this paper is to review and examine three of the most common corrosion characterization techniques specifically on Sn-Zn solders. The discussion will highlight the…

Effect of stearic acid coating on anti-oxidation property of Sn-Ag-Cu solder powder

Fen Peng, Wensheng Liu, Yufeng Huang, Siwei Tang, Chaoping Liang, Yunzhu Ma

The purpose of this study is to develop a monolayer surface coating of stearic acid on Sn-Ag-Cu solder powder to limit oxidation.