Table of contents
Ultrasonic bonding of flexible PCB to rigid PCB using an Sn interlayer
Kyoo‐Seok Kim, Jae‐Pil Jung, Y. Norman ZhouThe aim of the paper is to study the feasibility of direct ultrasonic bonding between contact pad arrays on flexible printed circuit boards (FPCB) and rigid printed circuit boards…
794
Optimisation modelling for thermal fatigue reliability of lead‐free interconnects in fine‐pitch flip‐chip packaging
Stoyan Stoyanov, Chris Bailey, Marc DesmulliezThis paper aims to present an integrated optimisation‐modelling computational approach for virtual prototyping that helps design engineers to improve the reliability and…
419
Geometry control of solder interconnects via induction heating
Hongbo Xu, Mingyu Li, Yonggao Fu, Ling Wang, Jongmyung KimThe aim of the paper is to control the height and shape of solder interconnects employed in electronic packaging applications by an induction heating reflow method, which can…
269
Lead‐free solder joint reliability estimation of flip chip package using FEM‐based sensitivity analysis
Chang‐Chun Lee, Kuo‐Chin Chang, Ya‐Wen YangIntegration of Cu/low‐k interconnects into the next‐generation integrated circuit chips, particularly for devices below the 90 nm technology node, has proved necessary to meet the…
551
ISSN:
0954-0911e-ISSN:
1758-6836ISSN-L:
0954-0911Online date, start – end:
1989Copyright Holder:
Emerald Publishing LimitedOpen Access:
hybridEditors:
- Professor Peng He
- Associate Professor Shuye Zhang