Soldering & Surface Mount Technology: Volume 20 Issue 3

The comparison studies on growth kinetic of IMC of Cu/Sn3.0Ag0.5Cu (Sn0.4Co0.7Cu)/Cu joints during isothermal aging and their tensile strengths

The purpose of this paper is to compare the growth kinetics of interfacial intermetallic compound (IMC) layer and its effect on the tensile strength of two solder (Sn3.0Ag0.5Cu…

Characterization of Sn7In4.1Ag0.5Cu solder in lead‐free composite solder joints of LTCC/PWB assembly

The purpose of this paper is to present a novel Sn7In4.1Ag0.5Cu/Plastic Core Solder Ball/Sn4Ag0.5Cu composite solder joint configuration for second‐level ball grid array (BGA…

Board level reliability of lead‐free designs of BGAs, CSPs, QFPs and TSOPs

The purpose of this paper is to describe the board level reliability test results of four IC packages with lead‐free balls/platings, soldered with lead‐free solder paste, during…

A procedure for determining the high‐speed stencil printing performance of solder pastes in an electronic service provider's environment

Environmental concerns over hazardous materials being placed in landfills have caused many countries to enact legislation to limit and/or eliminate the use of lead in electronic…

Solder paste characterisation: towards the development of quality control (QC) tool

The purpose of this paper is to develop a quality control tool based on rheological test methods for solder paste and flux media.

Silver thick film pastes for low temperature co‐fired ceramics: impact of glass frit variation

The purpose of this paper is to investigate and report the impact of glass frit variation in silver thick film pastes used as surface conductors in low temperature co‐fired…

OK International celebrates double awards in Asia

Siplace even more flexible and customer focused

Technology partnership between Assembléon and Valor

OK International collects Service Excellence Award at APEX 2008

DEK’s new InstinctivTM V9 software advances with HawkEyeTM control

NEW MG-8R joined Assembléon’s A-Series Pick & Place machines at Nepcon Shanghai

International diary

PDR launches accurate focussed IR rework in a handtool

ASML Chief Executive Officer Eric Meurice accepts extension of contract

New MPM stencil printer from Contax

Soldertec Global offers new “Same Day” X-ray inspection service

DEK celebrates its 40th year

NPL-IPTM from NPL

Enhanced software reduces setup time was introduced at APEX Stand 739 Step-by-step process improves efficiency

Editorial

HumiSeal® strengthens European presence with new Italian distribution agreement and signs new South African distribution agreement

Contax Installs New Essemtec Line at Gemini 2000

KSR International chooses Genesis GC-120Q for high-volume assembly

Economical high-volume Photo Etching is a reality

New ATF Vapour Phase soldering from Contax

New Programmable Preheater lowers soldering and rework temperatures

“ADHERE” LCD adhesives from make displays clear

Computer-guided connector assembly

DEK appoints new General Manager for the Americas

Award-winning ProFlow® technology from DEK evolves to broaden capability and expand process window

Qualified stencils reduce setup errors DEK uses ScanCAD inspection system to certify stencil fabrication