Table of contents
Allowable copper thickness for fine pitch patterns formed by a subtractive method
Takuya Yamamoto, Takashi Kataoka, John AndresakisThe subtractive method is widely used to produce high‐density PWBs. It is generally accepted that a pattern pitch of 100 microns or less cannot be achieved by the subtractive…
480
Specially developed glass fabrics for ultimate small diameter holes of high density board by build‐up method
Yasuyuki KimuraA developmental project has been initiated to create a new type of glass fabric, whose fibers are to be uniformly distributed in the laminate so as to comply with the requirement…
369
Elastic, elastic‐plastic and creep analyses of wafer level chip scale package solder joints on microvia build‐up printed circuit boards
John H. LauThe solder‐joint reliability of solder‐bumped wafer level chip scale package (WLCSP) on microvia build‐up printed circuit board (PCB) subjected to thermal cycling conditions is…
493
Residues in printed wiring boards and assemblies
Douglas PaulsThis paper is an examination of residues on printed wiring boards and printed wiring assemblies. Sources of residues are illustrated and the effects of various residues are…
354
ISSN:
0305-6120e-ISSN:
1758-602XISSN-L:
0305-6120Online date, start – end:
1974Copyright Holder:
Emerald Publishing LimitedOpen Access:
hybridEditor:
- Associate Professor Pooya Davari