Citation
(2001), "Future Automotive Wireless Packaging and Ford Research Laboratory Tour", Circuit World, Vol. 27 No. 1. https://doi.org/10.1108/cw.2001.21727aac.001
Publisher
:Emerald Group Publishing Limited
Copyright © 2001, MCB UP Limited
Future Automotive Wireless Packaging and Ford Research Laboratory Tour
Future Automotive Wireless Packaging and Ford Research Laboratory Tour
Organized by: International Wireless Packaging Consortium(TM) (IWPC(TM)).Dates: 11-13 December 2000Location: The Ritz Carlton Hotel, Dearborn, MIContact: Don Brown, IWPC Director. Tel: +1 215-491-2113; E-mail: donbrown@iwpc.org
The explosive growth in the Internet combined with the demand for new features, services and reduced costs in vehicles and vehicle infrastructure is driving the development of many products, which will deliver automotive wireless applications. People demand connectivity. The automobile is a prime location to deliver such services.
Frequencies from AM radio (kHz) to radar/automatic cruise control (~77 GHz) are being used in future automotive wireless applications. This leads to many interesting and challenging technical issues.
Also, the worldwide demand for telecommunications products and services is usurping capability and capacity from automotive wireless applications. The automotive industry is not the big fish, in this area.
Workshop goal
To explore the requirements of future automotive wireless applications and explore opportunities to reduce costs of automotive wireless packaging by pro-actively interacting with the telecommunication and automotive supply chains.
IWPC Interactive Technical Workshops, available to IWPC members only (two persons per IWPC Member Company), unlike traditional conferences and workshops, are highly interactive and are attended by senior technology and business leaders who make a commitment to cooperate to forward advanced packaging technology.
Proposed topics
- 1.
Automobile manufacturers' view of future market size and demands, timing, competitive advantages, reliability needs, maintenance requirements and their wish lists.
- 2.
Tier One's views and wish lists of the future markets and implications of complementary and competitive demands on the technology and products.
- 3.
Suppliers' view of future capabilities, manufacturing techniques, and their wish list.
- 4.
- •
Bluetooth vs. alternative short range radio technologies for automotive wireless application.
- •
Device and packaging solutions for radar applications (> 24 GHz).
- •
Electronic manufacturing service techniques for volume supply and cost reduction.
- •
Emerging device technologies for various automotive wireless applications.
- •
Ceramic and organic substrate solutions.
- •
Antenna technology, hidden in the vehicle.
- •
Intelligent vehicle technology.
- •
Device packaging technology for automotive applications.
- •
Environmental issues for "green products".
- •
Future Web-based exchanges and their impact on automotive wireless product applications.
- •
Other topics
- •