Microelectronics International: Volume 40 Issue 2

Guest editorial: Heterogeneous integration and chiplets interconnection

Shuye Zhang, Chong Leong Gan, Peng He, Kyung-Wook Paik

Properties of Cu/Zn+15%SAC0307+15%Cu/Al joints by different ultrasonic-assisted degrees

Tian Huang, Guisheng Gan, Cong Liu, Peng Ma, Yongchong Ma, Zheng Tang, Dayong Cheng, Xin Liu, Kun Tian

This paper aims to investigate the effects of different ultrasonic-assisted loading degrees on the microstructure, mechanical properties and the fracture morphology of…

Double-sided silicon vias (DSSVs) interconnection for large-sized interposer fabrication

Haibo Yang, Fengwei Dai, Liqiang Cao, Guofu Cao, Zhidan Fang, Qidong Wang

A large-scale detection system with more data in short time bins, small dead space and small signal identification is the ideology the scientists pursuing. These proposed demands…

Radiation-hardened flip-flop for single event upset tolerance

Chunhua Qi, Guoliang Ma, Yanqing Zhang, Tianqi Wang, Erming Rui, Qiang Jiao, Chaoming Liu, Mingxue Huo, Guofu Zhai

The purpose of this paper is to present a transition detector (TD)-based radiation hardened flip-flop (TDRH-FF) for single event upset (SEU).

Au-coated Ag alloy bonding wires with enhanced oxidation resistance for electronic packaging applications

Yuchen Xiao, Huiyi Tang, Hehe Zhang, Xiaoling Yang, Ling Sun, Yong Xie, Baoan Wu, Baifeng Luan, Weidong Xie, Xinnan Cai

The purpose of this paper is to develop high-performance Au-coated Ag alloy wires (ACAA wires) and demonstrate the effect of Au coating layers on the bonding performance and…

W-band antenna in package module with hybrid glass-compound WLFO process

Gang Wang, Chenhui Xia, Bo Wang, Xinran Zhao, Yang Li, Ning Yang

A W-band antennas-in-packages (AIP) module with a hybrid stacked glass-compound wafer level fan-out process was presented. Heterogeneous radio frequency (RF) chips were integrated…

Effects of 60Co γ ray radiation on the transmission characteristics of interconnection structures for 3D packaging

Youxin Zhang, Yang Liu, Rongxing Cao, Xianghua Zeng, Yuxiong Xue

Concerning the radiation effects on the three-dimensional (3D) packaging in space environment, this study aims to investigate the influence of the total dose effect on the…

Recent progress on bumpless Cu/SiO2 hybrid bonding for 3D heterogeneous integration

Ge Li, Qiushi Kang, Fanfan Niu, Chenxi Wang

Bumpless Cu/SiO₂ hybrid bonding, which this paper aims to, is a key technology of three-dimensional (3D) high-density integration to promote the integrated circuits industry’s…

Facile ligand-exchange strategy to promote low-temperature nano-sintering of oleylamine-capped Ag nanoparticles

Liyun Li, Yu Zhang, Shiyu Xia, Zhefei Sun, Junjie Yuan, Dongchuan Su, Hunjun Cao, Xiaoming Chai, Qingtian Wang, Jintang Li, Zhihao Zhang

This study aims to develop a facile ligand-exchange strategy to promote nano-sintering of oleylamine (OAM)-capped silver nanoparticles (AgNPs). By using ligand exchange process…

Effects of interface cracks on reliability of surface mount technology interconnection in service environment

Shaoyi Liu, Songjie Yao, Song Xue, Benben Wang, Hui Jin, Chenghui Pan, Yinwei Zhang, Yijiang Zhou, Rui Zeng, Lihao Ping, Zhixian Min, Daxing Zhang, Congsi Wang

Surface mount technology (SMT) is widely used and plays an important role in electronic equipment. The purpose of this paper is to reveal the effects of interface cracks on the…

A failure location technology for SiP devices based on TDR nondestructive testing method

Hui Xiao, Xiaotong Guo, Fangzhou Chen, Weiwei Zhang, Hao Liu, Zejian Chen, Jiahao Liu

Traditional nondestructive failure localization techniques are increasingly difficult to meet the requirements of high density and integration of system in package (SIP) devices…

The advanced leadless leadframe package and its characteristics

ByongJin Kim, HyeongIl Jeon, GiJeong Kim, WonBae Bang, JinYoung Khim

The purpose of this study is to offer the advanced leadless leadframe package which achieve small form factor and high thermal and electrical performance, according to the…

The preparation of anisotropic conductive paste and its application in FOB interconnection

Xionghui Cai, Aixia Zhai, Chenglong Zhou, Kyung-Wook Paik

The purpose of this study is to investigate the reliability of flex-on-board (FOB) interconnection connected with an anisotropic conductive paste (ACP), which is prepared by…