Guest editorial: Heterogeneous integration and chiplets interconnection

Citation

Zhang, S., Gan, C.L., He, P. and Paik, K.-W. (2023), "Guest editorial: Heterogeneous integration and chiplets interconnection", Microelectronics International, Vol. 40 No. 2, pp. 69-69. https://doi.org/10.1108/MI-03-2023-188

This special issue is based on the 2022 23rd International Conference on Electronic Packaging Technology (ICEPT), held on August 10–13, 2022. The aim of this special issue is to collect recent advances and developments of semiconductor applications, especially for the advanced packaging of heterogeneous integration and chiplets. It covers a variety scopes: system-in-package; fan-in/fan-out wafer level package; panel level chip-scale package; 2D, 2.1D and 2.3D integration; 2.5D integration; 3D IC integration; and chiplet heterogeneous integration.

Heterogeneous integration refers to the integration of different components manufactured separately into a higher-level assembly, thus constituting a more advanced packaging technology with higher integration, higher performance and more functions. As a heterogeneous integration technology, chiplet-based design technology integrates multiple heterogeneous dies of different functional circuit blocks into a single chip by using advanced packaging techniques, such as advanced packaging technology, advanced components, advanced ICs, advanced test carriers and advanced architectures.

In this issue, we collected 12 papers and covered the flip-chip technology, flex-on-board interconnection, double-sided silicon vias, Au-coated Ag alloy, W-band antenna, hybrid bonding, system-in-packaging integration, etc. We would like to thank the committee members of 2022 23rd ICEPT and appreciate the fruitful publication of experts in the field who participated in the submission and reviewing process for heterogeneous integration and chiplets interconnection. Next year, we hope to cooperate the ICEPT again and make a bigger success on 2023 24th ICEPT.