Table of contents
Novel layout technique for on‐chip inductance minimization
V.T.S. Dao, T.G. Etoh, M. Tanaka, T. AkinoThe purpose of this paper is to minimize on‐chip inductance effect for modern very large‐scale integration (VLSI), ultra large‐scale integration (ULSI) systems.
A highly miniaturized wireless inertial sensor using a novel 3D flexible circuit
J. Buckley, B. O'Flynn, J. Barton, S.C. O'MathunaThe purpose of this paper is to develop a highly miniaturized wireless inertial sensor system based on a novel 3D packaging technique using a flexible printed circuit (FPC). The…
Exploiting narrow values for faster parity generation
Yusuf Onur Koçberber, Yusuf Osmanlıoğlu, Oğuz ErginThe purpose of this paper is to reduce parity generation latency if the input value is narrow.
Micro‐flow sensor for water using NTC thick film segmented thermistors
O.S. Aleksic, S.M. Savic, M.V. Nikolic, L. Sibinoski, LukovicThe purpose of this paper is to apply negative thermal coefficient (NTC) thick film segmented thermistors (TFSTs) in a micro‐flow sensor for water.
Application of a low‐glitch current cell in 10‐bit CMOS current‐steering DAC
Zhi‐Yuan Cui, Joong‐Ho Choi, Yeong‐Seuk Kim, Shi‐Ho Kim, Nam‐Soo KimThe purpose of this paper is to describe the application of low‐glitch current cell in a digital to analog converter (DAC) to reduce the clock‐feedthrough effect and achieve a low…
Chemical characterization of failures and process materials for microelectronics assembly
Chien‐Yi Huang, Ming‐Shu Li, Chen‐Liang Ku, Hao‐Chun Hsieh, Kung‐Cheng LiThe purpose of this paper is to discuss the chemical characterization of failures and process materials for microelectronics assembly.
Effects of process variation in VLSI interconnects – a technical review
K.G. Verma, B.K. Kaushik, R. SinghProcess variation has become a major concern in the design of many nanometer circuits, including interconnect pipelines. The purpose of this paper is to provide a comprehensive…
Response of Ag thick film microstrip equilateral triangular patch antenna to overlay of moisture laden soybean
Vaishali Mane, Vijaya PuriThe purpose of this paper is to report on the Ku band microwave characteristics of moisture laden soya seeds using overlay technique.
ISSN:
1356-5362e-ISSN:
1758-812XISSN-L:
1356-5362Online date, start – end:
1982Copyright Holder:
Emerald Publishing LimitedOpen Access:
hybridEditor:
- Professor John Atkinson