Microelectronics International: Volume 12 Issue 2

International co-operation —A benefit for us all!

SØREN NØRLYNG

Excess Noise in Thick Film Resistors: Volume Dependence

A. Masoero, B. Morten, M. Tamborin, M. Prudenziati

Shrinkage Matched Cofireable Buried Resistors for Tape

S. Vasudevan, A. Shaikh, B. Sjoling

New Resistor Systems for Hybrid Circuits and Resistive Components

P. O'Callaghan, A.T. Walker, K.W. Hang, V.P. Siuta, J.J. Osborne, J. Smith, K. Hayakawa, A. Buckthorpe

Evaluating a Thick Film System for All Ag and for Pd/Ag, Au ‘Mixed Metallurgy’ Multilayer Applications

P. Baumbach, M. Bilinski, J. Whitmarsh, J. Lorenz, P. Bless, M.A. Stein

The Utilising of Gravure Offset Printing for Miniaturising of Electronic Packages

M. Lahti, K. Kukkola, S. Leppävuori

The Effect of Moisture on Die Attach Joints Made with Silver Filled Epoxy

O. Rusanen, J. Lenkkeri, L. Kivimaäki

A Screen Printed Multilayer PZT Actuator with an Integrated Force Sensor

H. Moilanen, S. Leppävuori

Multichip Modules — Communications Markets and Materials Opportunities for Space

N. Sinnadurai

Understanding Anisotropic Conducting Adhesive Behaviour

J.M. Goward, D.C. Whalley, D.J. Williams

An Introduction to the Very Small Peripheral Array (VSPA™)

M.M. Portuondo