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The Effect of Moisture on Die Attach Joints Made with Silver Filled Epoxy

O. Rusanen, J. Lenkkeri, L. Kivimaäki

Microelectronics International

ISSN: 1356-5362

Article publication date: 1 May 1995

37

Citation

Rusanen, O., Lenkkeri, J. and Kivimaäki, L. (1995), "The Effect of Moisture on Die Attach Joints Made with Silver Filled Epoxy", Microelectronics International, Vol. 12 No. 2, pp. 25-27. https://doi.org/10.1108/eb044561

Publisher

:

Emerald Group Publishing Limited

Copyright © 1995, Emerald Group Publishing Limited

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