The Effect of Moisture on Die Attach Joints Made with Silver Filled Epoxy
Citation
Rusanen, O., Lenkkeri, J. and Kivimaäki, L. (1995), "The Effect of Moisture on Die Attach Joints Made with Silver Filled Epoxy", Microelectronics International, Vol. 12 No. 2, pp. 25-27. https://doi.org/10.1108/eb044561
Publisher
:Emerald Group Publishing Limited
Copyright © 1995, Emerald Group Publishing Limited