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This paper aims to study the performance of hydrostatic turntables by using fluid structure interaction (FSI) and thermal effect coupled model.

A novel fluid-structure-thermal coupled model is set up to study the problem. The FSI technique and computational fluid dynamics (CFD) method are used by this new model, and the thermal effects are also considered. Hydrostatic turntables with different system parameters (oil supply pressure, oil recess depth and surface roughness) are studied under different working conditions (rotational speeds of turntable and exerted external loads). Performance characteristics obtained from this FSI-thermal coupled model and conventional model are presented and compared.

Theoretical predictions are in good agreement with the experimental data. The results of new FSI-thermal coupled model are more accurate than those of the old conventional model. To acquire better performance of the system, the novel FSI-thermal model becomes necessary for different hydrostatic turntable systems.

This developed model is a useful tool for studying hydrostatic turntables. To get an improved performance, a proper selection of design parameters of the system based on FSI-thermal model is essential.

This paper aims to investigate the thermal fluid–structure interactions (FSIs) of printed circuit boards (PCBs) at different component configurations during the wave soldering process and experimental validation.

The thermally induced displacement and stress on the PCB and its components are the foci of this study. Finite volume solver FLUENT and finite element solver ABAQUS, coupled with a mesh-based parallel code coupling interface, were utilized to perform the analysis. A sound card PCB (138 × 85 × 1.5 mm3), consisting of a transistor, diode, capacitor, connector and integrated circuit package, was built and meshed by using computational fluid dynamics pre-processing software. The volume of fluid technique with the second-order upwind scheme was applied to track the molten solder. C language was utilized to write the user-defined functions of the thermal profile. The structural solver analyzed the temperature distribution, displacement and stress of the PCB and its components. The predicted temperature was validated by the experimental results.

Different PCB component configurations resulted in different temperature distributions, thermally induced stresses and displacements to the PCB and its components. Results show that PCB component configurations significantly influence the PCB and yield unfavorable deformation and stress.

This study provides PCB designers with a profound understanding of the thermal FSI phenomenon of the process control during wave soldering in the microelectronics industry.

This study provides useful guidelines and references by extending the understanding on the thermal FSI behavior of molten solder for PCBs. This study also explores the behaviors and influences of PCB components at different configurations during the wave soldering process.

This study aims to investigate a critical review on the applications of fluid-structure interaction (FSI) in porous media.

Transport phenomena in porous media are of continuing interest by many researchers in the literature because of its significant applications in engineering and biomedical sectors. Such applications include thermal management of high heat flux electronic devices, heat exchangers, thermal insulation in buildings, oil recovery, transport in biological tissues and tissue engineering. FSI is becoming an important tool in the design process to fully understand the interaction between fluids and structures.

This study is structured in three sections: the first part summarizes some important studies on the applications of porous medium and FSI in various engineering and biomedical applications. The second part focuses on the applications of FSI in porous media as related to hyperthermia. The third part of this review is allocated to the applications of FSI of convection flow and heat transfer in engineering systems filled with porous medium.

To the best knowledge of the present authors, FSI analysis of turbulent flow in porous medium never been studied, and therefore, more attention should be given to this area in any future studies. Moreover, more studies should also be conducted on mixed convective flow and heat transfer in systems using porous medium and FSI.

The wall of the blood vessel is considered as a flexible multilayer porous medium, and therefore, rigid wall analysis is not accurate, and therefore, FSI should be implemented for accurate predictions of flow and hemodynamic stresses.

The use of porous media theory in biomedical applications received a great attention by many investigators in the literature (Khanafer and Vafai, 2006a; Al-Amiri et al., 2014; Lasiello et al., 2016a, Lasiello et al., 2016b; Lasiello et al., 2015; Chung and Vafai, 2013; Mahjoob and Vafai, 2009; Yang and Vafai, 2008; Yang and Vafai, 2006; Ai and Vafai, 2006). A comprehensive review was conducted by Khanafer and Vafai (2006b) summarizing various studies associated with magnetic field imaging and drug delivery. The authors illustrated that the tortuosity and porosity had a profound effect on the diffusion process within the brain. AlAmiri et al. (2014) conducted a numerical study to investigate the effect of turbulent pulsatile flow and heating technique on the thermal distribution within the arterial wall. The results of that investigation illustrated that local heat flux variation along the bottom layer of the tumor was greater for the low-velocity condition. Yang and Vafai (2006) presented a comprehensive four-layer model to study low-density lipoprotein transport in the arterial wall coupled with a lumen (Figure 1). All the four layers (endothelium, intima, internal elastic lamina and media) were modeled as a homogenous porous medium.

Future studies on the applications of FSI in porous media are recommended in this review.

High pressure and high speed of the axial piston pump can improve its power density, but they also deteriorate the thermal-fluid-structure coupling effect of the friction pairs. This paper aims to reveal the coupling mechanism of the pump, for example, valve plate pair, by carrying out research on multi-physics field coupling.

Considering the influences of temperature on material properties and thermal fluid on structure, the thermal-fluid elastic mechanics model is established. A complete set of fast and effective thermal-fluid-structure coupling method is presented, by which the numerical analysis is conducted for the valve plate pair.

According to calculations, it is revealed that the temperature and pressure evolution laws of oil film with time, the pressure distribution law of the fluid, stress and displacement distribution laws of the solid in the valve plate pair. In addition, the forming history of the wedge-shaped oil film and mating clearance change law with rotational speed and outlet pressure in the valve plate pair are presented.

For an axial piston pump operating under high speed, high pressure and wide temperature range, the multi-physics field coupling analysis is an indispensable means and method. This paper provides theoretical evidence for the development of the pump and lays a solid foundation for the research of the same kind of problem.

The purpose of this paper is to study the influences of recess configurations on the performances of high-speed hybrid journal bearing. Hybrid journal bearing earns increasing attention in high-speed machine tool spindle owing to its intrinsic outstanding performances of low temperature rise and high stability.

To investigate the coupled effects of temperature, turbulence and the interaction between lubricant and journal/bearing bush, a thermal fluid-structure interaction approach is presented and validated by the experimental results.

Ladder-type recess has excellent tribological characteristics in decreasing temperature rise, improving stability and inhibiting cavitation, which are all beneficial to improve the performances of high-speed spindle system.

This work can be a valuable guide for the future high-speed hybrid journal bearing design.

The aim of this study is to investigate the effects of offset angle in wave soldering by using thermal fluid structure interaction modeling with experimental validation.

The authors used a thermal coupling approach that adopted mesh-based parallel code coupling interface between finite volume-and finite element-based software (ABAQUS). A 3D single pin-through-hole (PTH) connector with five offset angles (0 to 20°) on a printed circuit board (PCB) was built and meshed by using computational fluid dynamics preprocessing software called GAMBIT. An implicit volume of fluid technique with a second-order upwind scheme was also applied to track the flow front of solder material (Sn63Pb37) when passing through the solder pot during wave soldering. The structural solver and ABAQUS analyzed the temperature distribution, displacement and von Mises stress of the PTH connector. The predicted results were validated by the experimental solder profile.

The simulation revealed that the PTH offset angle had a significant effect on the filling of molten solder through the PCB. The 0° angle yielded the best filling profile, filling time, lowest displacement and thermal stress. The simulation result was similar to the experimental result.

This study provides a better understanding of the process control in wave soldering for PCB assembly.

This study provides fundamental guidelines and references for the thermal coupling method to address reliability issues during wave soldering. It also enhances understanding of capillary flow and PTH joint issues to achieve high reliability in PCB assembly industries.

This study aims to investigate the effects of thermal buoyancy and flow incidence angles on mixed convection heat transfer and vortex-induced vibration (VIV) of an elastically mounted circular cylinder. The focus is on understanding how varying these parameters influences the vibration amplitudes in both the x and y directions and the overall heat transfer performance.

The research involves a numerical simulation of thermal fluid-structure interactions by integrating rigid-body motion equations with heat and fluid flow solvers. The cylinder operates at a lower temperature than the mainstream flow, and flow incidence angles range from 0° (opposing gravity) to 90° (perpendicular to gravity). The methodology is validated by comparing the results with established data on VIV for a cylinder vibrating in one direction under thermal buoyancy effects.

The study reveals that, without buoyancy (Ri = 0), increasing the flow angle from 0° to 90° decreases the vibration amplitude along the x-direction (A_x) while increasing it along the y-direction (A_y) across various reduced velocities (U_r). When buoyancy effects are introduced (Ri = −1), A_x peaks at specific U_r values depending on the flow angle, with significant variations observed. The maximum increase in A_x at Ri = −1 is over 15 times at U_r = 9 for a 0° angle, and A_y shows a more than 10-fold increase at U_r = 8 for a 30° angle. Additionally, adjusting the flow angle results in up to an 8% increase in the mean Nusselt number at Ri = −1.

This research provides novel insights into the combined effects of flow incidence angles and thermal buoyancy on VIV and heat transfer in an elastically mounted cylinder.

The purpose of this study is to investigate heat transfer and deformation of flexible printed circuit board (FPCB) under thermal and flow effects by using fluid structure interaction. This study simulate the electronic cooling process when electronic devices are generating heat during operation at FPCB under force convection.

The thermal and flow effects on FPCB with attached ball grid array (BGA) packages have been investigated in the simulation. Effects of Reynolds number (Re), number of BGA packages attached, power supplied to the BGA packages and size of FPCB were studied. The responses in the present study are the deflection/length of FPCB (δ/L) and Nusselt number (Nu).

It is important to consider both thermal and flow effects at the same time for understanding the characteristic of FPCB attached with BGA under operating condition. Empirical correlation equations of Re, Prandtl number (Pr), δ/L and Nu have been established, in which the highest effect is of Re, followed by Pr and δ/L. The δ/L and Nu¯ were found to be significantly affected by most of the parametric factors.

This study provides a better understanding of the process control in FPCB assembly.

This study provides fundamental guidelines and references for the thermal coupling modelling to address reliability issues in FPCB design. It also increases the understanding of FPCB and BGA joint issues to achieve high reliability in microelectronic design.

This study aims to investigate the interaction of independent variables [Reynolds number (Re), thermal power and the number of ball grid array (BGA) packages] and the relation of the variables with the responses [Nusselt number ((Nu) ¯ ), deflection/FPCB’s length (d/L) and von Mises stress]. The airflow and thermal effects were considered for optimizing the Re of various numbers of BGA packages with thermal power attached on flexible printed circuit board (FPCB) for optimum cooling performance with least deflection and stress by using the response surface method (RSM).

Flow and thermal effects on FPCB with heat source generated in the BGA packages have been examined in the simulation. The interactive relationship between factors (i.e. Re, thermal power and number of BGA packages) and responses (i.e. deflection over FPCB length ratio, stress and average Nusselt number) were analysed using analysis of variance. RSM was used to optimize the Re for the different number of BGA packages attached to the FPCB.

It is important to understand the behaviour of FPCB when exposed to both flow and thermal effects simultaneously under the operating conditions. Maximum d/L and von Misses stress were significantly affected by all parametric factors whilst (Nu)¯ is significantly affected by Re and thermal power. Optimized Re for 1–3 BGA packages with maximum thermal power applied has been identified as 21,364, 23,858 and 29,367, respectively.

This analysis offers a better interpretation of the parameter control in FPCB with optimized Re for the use of force convection electronic cooling. Optimal Re could be used as a reference in the thermal management aspect in designing the BGA package.

This research presents the parameters’ effects on the reliability and heat transfer in FPCB design. It also presents a method to optimize Re for the different number of BGA packages attached to increase the reliability in FPCB’s design.

The purpose of this paper is to study the mechanical properties of aerostatic guideway taking the structural deformation into account, and further improve the calculation method of guideway.

A theoretical model of fluid-structure interaction for the numerical simulation was established and mechanical properties of the aerostatic guideway with porous restrictors were solved based on computational fluid dynamics. The deformation law of the guideway with different materials and gas-film thicknesses was revealed, and its static and dynamic characteristic curves were obtained.

The results indicate that ceramics as the material of guideways exhibit good applicability due to the small deformation, the quick dynamic response and the relatively light weight. The rational initial gas-film of guideway is recommended.

The present work can provide ideas for the design and optimization of aerostatic guideways.

The peer review history for this article is available at: https://publons.com/publon/10.1108/ILT-07-2019-0288