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Article
Publication date: 1 April 1992

A.L. Alexsandrov, P.A. Androsenko, V.M. Bedanov, A.M. Bekesheva, E.E. Dagnan, O.E. Dnitrieva, G.V. Gadiyak, V.P. Ginkin, M.S. Ivanov, Zh.L. Korobitsina, T.M. Lukhanova, M.S. Obrekht, A.A. Shinanskiy, V.A. Schveigert, I.V. Schveigert, E.G. Tishkovsky and Yu.P. Zhydkov

In this paper the MOPIT system for the simulation of devices and manufacturing processes is presented. The MOPIT system is meant for the simulation of the following semiconductor…

Abstract

In this paper the MOPIT system for the simulation of devices and manufacturing processes is presented. The MOPIT system is meant for the simulation of the following semiconductor processing : ion implantation of impurities , diffusion , radiation enhanced diffusion , thermal oxidation of silicon , molecular‐beam epitaxy, plasma‐chemical etching and deposition, cross‐sectional profile evolution of trench in plasma‐etching and deposition; as well as the following devices: MOS‐structures , high‐voltage diode, element of memory, charge accumulation in a sub‐gate dielectric.

Details

COMPEL - The international journal for computation and mathematics in electrical and electronic engineering, vol. 11 no. 4
Type: Research Article
ISSN: 0332-1649

Article
Publication date: 1 April 1986

G.V. GADIYAK, M.S. OBRECHT and S.P. SINITSA

In this paper we consider the effects of recombination during polarization on passing a current through SiN4 and SiO2. In the literature, some works have been devoted to the…

Abstract

In this paper we consider the effects of recombination during polarization on passing a current through SiN4 and SiO2. In the literature, some works have been devoted to the problem of the passage of a current through MNOS‐structures. However, these studies related mainly to monopolar injection or bipolar injection but ignored recombination.

Details

COMPEL - The international journal for computation and mathematics in electrical and electronic engineering, vol. 5 no. 4
Type: Research Article
ISSN: 0332-1649

Article
Publication date: 1 April 1993

G.V. Gadiyak and D.E. Blaghinin

The radiation enhanced diffusion of implanted boron was modeled by considering the kinetic reaction between point defects, dislocations and boron atoms. The diffusion model…

Abstract

The radiation enhanced diffusion of implanted boron was modeled by considering the kinetic reaction between point defects, dislocations and boron atoms. The diffusion model utilizes Monte‐Carlo generated point defect profile, generated dislocation profile for high doze hydrogen implantation. Excellent simulation results has been achieved by using a single set of diffusion and kinetic parameters to model the radiation enhanced diffusion of boron for a wide range of hydrogen implanted doses.

Details

COMPEL - The international journal for computation and mathematics in electrical and electronic engineering, vol. 12 no. 4
Type: Research Article
ISSN: 0332-1649

Article
Publication date: 1 April 1992

G.V. Gadiyak, J.L. Korobitsina and V.I. Kranarenko

Computer code complex for the thermal oxidation of silicon is presented. There are one‐dimensional model and two‐ dimensional models:the model of viscoelastic oxide and the…

Abstract

Computer code complex for the thermal oxidation of silicon is presented. There are one‐dimensional model and two‐ dimensional models:the model of viscoelastic oxide and the hydrodynamical models — an ideal fluid and a viscous fluid models. If nitride mask is absent, a one‐dimensional model is used.The influence of an induced stress on the diffusion and reaction is taken into account.

Details

COMPEL - The international journal for computation and mathematics in electrical and electronic engineering, vol. 11 no. 4
Type: Research Article
ISSN: 0332-1649

Article
Publication date: 1 April 1993

G.V. Gadiyak, J.L. Korobitsina and V.I. Kramarenko

The model of the thermal oxidation of polycrystalline silicon is described. It includes parabolic equation system for the diffusion process of oxidant in polycrystalline oxide…

Abstract

The model of the thermal oxidation of polycrystalline silicon is described. It includes parabolic equation system for the diffusion process of oxidant in polycrystalline oxide, equations system for the deformation of oxide and nitride mask. The numerical calculations of the reverse L‐shape sealed polybuffer LOCOS are presented.

Details

COMPEL - The international journal for computation and mathematics in electrical and electronic engineering, vol. 12 no. 4
Type: Research Article
ISSN: 0332-1649

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