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‘Soldering and Cleaning in Electronics’ international conference, including an exposition, took place in Brno on 12–13 October 1993. The conference was organised by SMT‐Info, together with the ISHM‐Czech and Slovak Chapter. The purpose of this common action was to bring together the professionals in surface mount technology and thick film technology. In the framework of the conference, in which 130 home and foreign delegates participated, the annual meeting of the ISHM‐Czech and Slovak Chapter took place.

Silver and other metals can exhibit dendritic short‐circuit growth caused by electrochemical migration in conductor‐insulator structures. Detailed analysis of migration‐free thick film systems using migration‐free conductors has demonstrated that not only metallic components, but also dielectric constituent materials can contribute to the formation of migrated shorts after a chemical reduction process.

In the last few years many new types of light‐guiding optical film structures have been developed. Several applications have been published in the field of optical and optoelectronic integrated circuits, sensor‐elements, etc. The basic component of these systems is the optical waveguide which can be realised with optical fibres or fabricated as a layer structure from different dielectrics and many kinds of glasses. The purpose of this paper is to describe some problems and solutions of optical waveguide thick film manufacturing and also connecting techniques with optical fibres.

Atmospheric dependent, gas sensitive resistors seem to be good candidates for detecting critical air pollution levels. Recently, great progress has been made in the development of various sensor types, but less attention seems to be paid to the integration of sensor elements with different characteristics. The aim of this international project is to develop a smart hybrid gas multi‐sensor module for environmental applications, i.e. by combining classical thick‐ and thin‐film elements with polymer‐film based sensors and also a signal processing ASIC within a single package, which should be useful for all sensor types. The module should enable multi‐sensor operation as well, when connected to an intelligent signal‐processing unit.

Sensors have gained a wide theoretical interest and practical application in biomedicine. They can be used for very different purposes and may offer unique possibilities. The paper gives a broad summary about the biomedical sensor application fields and about their technologies. Finally, the present status and perspectives are summarised.

The purpose of this paper is to provide greater understanding of attractiveness of different wine region types, especially less attractive wine regions. The paper examines the different wine tourist segments’ preferences towards wine region types.

The preferences of wine tourists were analysed based on an online self-administered survey with 8,552 respondents in Hungary. The wine regions were divided into four categories based on their wine and touristic attractiveness: wine dominant, touristic attraction dominant, complex and non-dominant wine regions. Wine region types were examined based on wine travel frequency and also by subjective wine expertise.

Wine tourist groups based on wine travel frequency and subjective wine expertise have significantly different preferences towards wine region types. Less attractive wine regions are more popular among frequent travellers and wine experts.

The outcome of this research highlights the importance of designing diverse marketing strategies depending on the wine region type. Less attractive wine regions and little-known wineries should focus on frequent travellers and wine experts and provide a complex and high standard experience, as these consumers are more open and have higher expectations of a travel destination.

The study revealed the different wine tourist preferences with regard to the various types of wine regions. Wine-related and non-wine-related aspects were studied in a complex manner.

Lays out a framework for analysing ethics in organizations. Relying on methodological individualism, introduces five building blocks for the framework: self‐interest, individual rationality, sequential rationality, incentive compatibility, and reputation. Uncritical use of the self‐interest model may induce framing effects, blinding less cautious users to important ethical dimensions. Illustrates the richness and “ethical flavour” of an appropriately considered self‐interest model through focusing one of the individual agent’s real interests in a broad sense, through the use of the time factor in the building blocks, and through suggesting how the individual agent can interpret the value systems in her surroundings.

This paper aims to present a new methodology to manufacture micro-channels suitable for high operating pressures and micro particle image velocimetry (μPIV) measurements using a rapid-prototyping high-resolution 3D printer. This methodology can fabricate channels down to 250 μm and withstand pressures of up to 5 ± 0.2 MPa. The manufacturing times are much shorter than in soft lithography processes.

The novel manufacturing method developed takes advantage of the recently improved resolution in 3D printers to manufacture an rapid prototyping technique part that contains the hose connections and a micro-channel useful for microfluidics. A method to assemble one wall of the micro-channel using UV curable glue with a glass slide is presented – an operation required to prepare the channel for μPIV measurements. Once built, the micro-channel has been evaluated when working under pressure and the grease flow behavior in it has been measured using μPIV. Furthermore, the minimum achievable channels have been defined using a confocal microscopy study.

This technique is much faster than previous micro-manufacturing techniques where different steps were needed to obtain the micro-machined parts. However, due to current 3D printers ' resolutions (around 50 μm) and according to the experimental results, channels smaller than 250-μm2 cross-section should not be used to characterize fluid flow behaviors, as inaccuracies in the channel boundaries can deeply affect the fluid flow behavior.

The present methodology is developed due to the need to validate micro-channels using μPIV to lubricate critical components (bearings and gears) in wind turbines.

This novel micro-manufacturing technique overcomes current techniques, as it requires less manufacturing steps and therefore it is faster and with less associated costs to manufacture micro-channels down to 250-μm2 cross-section that can withstand pressures higher than 5 MPa that can be used to characterize microfluidic flow behavior using μPIV.

The purpose of the paper is to improve the control of vapour phase soldering (VPS). To enable better productivity and assembling quality, the industry needs to provide precise control and measurements during assembling. In the paper, a special monitoring method is presented for VPS to enable improved process control and oven state identification.

The work presents the investigation of the workspace with dynamic and gage type pressure sensors in fusion with thermocouples. Different sensors were evaluated to find an appropriate type. The relation between the temperature and the pressure was investigated, according to the setup of the oven. The effect of inserting a printed circuit board (PCB) on the pressure of the vapour inside the oven was also investigated with the pressure/power functions.

It was found that the novel gage-type sensors enable better precision than solutions seen in previous literature. The sensors are able to monitor the decreasing vapour concentration when a PCB is inserted to the workspace. It was found that there is a suggested minimum power to sustain a well-developed vapour column for soldering in saturated vapour. An inflexion point highlights this in the pressure/power function, in accordance with the temperature/power curve.

The research presents original works with aspects of a novel sensor fusion concept and work space monitoring for better process control and improved soldering quality.