Dendritic Growth from Dielectric Constituents in Thick Film ICs

Abstract

Silver and other metals can exhibit dendritic short‐circuit growth caused by electrochemical migration in conductor‐insulator structures. Detailed analysis of migration‐free thick film systems using migration‐free conductors has demonstrated that not only metallic components, but also dielectric constituent materials can contribute to the formation of migrated shorts after a chemical reduction process.

Citation

Harsányi, G. (1992), "Dendritic Growth from Dielectric Constituents in Thick Film ICs", Microelectronics International, Vol. 9 No. 1, pp. 54-59. https://doi.org/10.1108/eb044469