Table of contents
Interactions between Thick Film Superconductors and Various Metal Substrates
M. Hrovat, S. Bernik, D. KolarInteractions between stainless steel and silver and gold based thick film conductors and YBa2Cu3O7 thick film superconductors were studied by SEM and EDX. The stainless steel…
Investigations of Laser Soldered TAB Inner Lead Contacts
E. Zakel, G. Azdasht, H. ReichlTape Automated Bonding (TAB) is a modern technology which meets the requirements for micro‐connecting VLSI circuits. The limitations for gang bonding chips with high lead counts…
Optimised Nitrogen‐based Atmospheres for Copper Thick Film Manufacture: Part 2: A Comparison of the Effects of Different Gaseous Dopants
S. Mellul, D. Navarro, F. RotmanThis paper reports the final results of a development project conducted on nitrogen‐based atmospheres in order to improve the firing of copper thick films. Having shown that…
Optimised Laser Micromachining Technology for TFT‐LCD Modules
T. Tobita, K. Niki, K. Inouye, H. TakasagoAdvanced laser micromachining techniques for a TFT‐LCD (thin film transistor‐liquid crystal display) module have been developed to repair various kinds of defects such as shorts…
A Conformal Mapping Analysis of Polygonal Planar Resistors with Curved Boundaries
M.A. Chaudhry, R. SchinzingerIntroduction of curved boundaries in polygonally shaped integrated circuit planar resistors causes a crease in maximum electric field intensities and current densities present in…
Accuracy of Temperature Computation in Hybrid Microelectronics
A. KosTemperature field computations of hybrid power circuits require considerable numerical effort. This paper presents rules which show both how to limit the number of terms of the…
Development/Study of Thin Films for Electroluminescent Flat Panel Display
P.V. Natarajan, D.G. Vaiude, B.M. RaoThis paper concerns an all‐solid‐state, high‐contrast electroluminescent (EL) flat panel display which is becoming the potential for multifunctional avionic displays. In this…
Dendritic Growth from Dielectric Constituents in Thick Film ICs
G. HarsányiSilver and other metals can exhibit dendritic short‐circuit growth caused by electrochemical migration in conductor‐insulator structures. Detailed analysis of migration‐free thick…
Education in Hybrid Microelectronics: Part 1
J. Atkinson, K. Pitt, K. WilliamsISHM, acting as a professional body for a very large sector of microelectronics manufacturing and design, naturally takes a strong and active interest in the education and…
ISHM news
B. Waterfield, Geoff GriffithsAt the Annual General Meeting of ISHM‐France, held on 12 June 1991, the following were elected:
Industry news
Coors Ceramics Company has appointed Derek Johnson as an Executive Director with responsibility for the operation of Coors Ceramics Electronics Limited.
ISSN:
1356-5362e-ISSN:
1758-812XISSN-L:
1356-5362Online date, start – end:
1982Copyright Holder:
Emerald Publishing LimitedOpen Access:
hybridEditor:
- Professor John Atkinson