Table of contents
Nano‐ and micro‐filled conducting adhesives for z‐axis interconnections: new direction for high‐speed, high‐density, organic microelectronics packaging
Rabindra N. Das, Frank D. Egitto, Voya R. MarkovichThe purpose of this paper is to discuss the use of epoxy‐based conducting adhesives in z‐axis interconnections.
1183
“Green” PCB production processes
Sven Lamprecht, Günter Heinz, Neil Patton, Stephen Kenny, Patrick BrooksThe purpose of this paper is to show production process developments and innovations that resolve many of the issues faced with certain process steps for printed circuit board…
941
The process and pastes for the via hole plugging of HDI PCBs
Manfred SuppaThe purpose of this paper is to present the materials and process considerations and solutions that enable the safe use of plugging pastes in high density interconnection (HDI…
497
Methods for dissipating heat from RF circuit boards
Markus WilleThe purpose of this paper is to present methods for dissipating heat from RF circuit boards.
406
A review of liquid crystal display technologies, electronic interconnection and failure analysis
C.A. SmithThe purpose of this paper is to discuss the chemistry of organic compounds with a liquid crystal phase and their application in flat panel electronic displays.
1718
ISSN:
0305-6120e-ISSN:
1758-602XISSN-L:
0305-6120Online date, start – end:
1974Copyright Holder:
Emerald Publishing LimitedOpen Access:
hybridEditor:
- Associate Professor Pooya Davari