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Data service (DS) is a special software service that enables data access in cloud environment and provides a unified data model for cross-origination data integration and data sharing. The purpose of the work is to automatically compose DSs and quickly generate data view to satisfy users' various data requirements (DRs).

The paper proposes an automatic DS composition and view generation approach. DSs are organized into DS dependence graph (DSDG) based on their inherent dependences, and DSs can be automatically composed using the DSDG according to user's DRs. Then, data view will be generated by interpreting the composed DS.

Experimental results with real cross-origination data sets show the proposed approaches have high efficiency and good quality for DS composition and view generation.

The authors propose a DS composition algorithm and a data view generation algorithm according to users' DRs.

With the continuous development of online shopping, analyzing the competitiveness of products in the fierce market competition is becoming increasingly crucial to position their own product development. However, the information overload brought by the network development makes it getting difficult to obtain the accurate competitiveness information. Therefore, competitiveness analysis research to combine with the perceived helpfulness study needs urgent solution. Furthermore, deviations exist in the three common methods of perceived helpfulness research. Finally, the traditional information fusion analysis only analyzes the advantages and disadvantages of products in competitiveness analysis without taking account of the competitive environment.

This study puts forward a novel prediction model of perceived helpfulness in conjunction of unsupervised learning and sentiment analysis techniques, to conduct the comparison with pros and cons of congeneric products.

This paper adopts Wilcoxon test to demonstrate the significant rectification of our competitiveness analysis to the traditional methods. It is noted that the positive reviews of the products in this study impact more on product word of mouth and competitiveness than negative ones.

To sum up, the results of this study benefit businesses in locating their dynamic market position with competitors in practice and exploring new method for long-term development strategic planning.

This paper aims to propose a modified full-additive method (MFAM) to fabricate fine copper lines for high density interconnection (HDI) printed circuit boards (PCBs). In addition, the surface of the fine copper lines is treated with a brown oxidation process to obtain good adhesion between the copper and the dielectric resin.

Fine copper lines fabricated by MFAM were observed to evaluate the undercut quality, in comparison to undercut quality of copper lines fabricated by the semi-additive method and the subtractive method. The effect of the thickness of the dry film on the quality of the copper plating was investigated to obtain the regular shape of fine lines. The fine copper lines treated with the brown oxidation process were also examined to generate a coarse surface microstructure to improve the adhesion between the copper and the dielectric resin. The cross section and surface of as-fabricated fine copper lines were characterized using an optical microscope, a scanning electron microscope and an atomic force microscope.

MFAM has the potential to fabricate high-performance fine copper lines for HDI PCBs. Undercut of as-fabricated fine copper lines could be prevented to meet the design requirement of impedance. In addition, fine copper lines exhibit enough adhesive force to laminate with dielectric resin after the brown oxidation process.

MFAM, with the advantages of high efficiency and being a facile process, is developed to fabricate high-quality fine copper lines for industrial HDI PCB manufacture.

Optimized plating conditions, included proper designs of insulating shield (IS), auxiliary cathode (AC) and different patterns, contribute to the uniformity enhancement of copper deposition.

Plating experiments were implemented in vertical continuous plating (VCP) line for manufacturing in different conditions. Multiphysics coupling simulation was brought to investigate and predict the plating uniformity improvement of copper pattern. In addition, the numerical model was based on VCP to approach the practical application.

With disproportionate current distribution, different plating pattern design formed diverse copper thickness distribution (CTD). IS and AC improved plating uniformity of copper pattern because of current redistribution. Moreover, optimized plating condition for effectively depositing more uniformed plating copper layer in varied pattern designs were derived by simulation and verified by plating experiment.

The comparison between experiment and simulation revealed that multiphysics coupling is an efficient, reliable and of course environment-friendly tool to perform research on the uniformity of pattern plating in manufacturing.

The purpose of this paper is to establish an accurate model to quantify the effect of conductor roughness on insertion loss (IL) and provide improved measurements and suggestions for manufacturing good conductive copper lines of printed circuit board.

To practically investigates the modified model of conductor roughness, three different kinds of alternate oxidation treatments were used to provide transmission lines with different roughness. The IL results were measured by a vector net analyzer for comparisons with the modified model results.

An accurate model, with only a 1.8% deviation on average from the measured values, is established. Compared with other models, the modified model is more reliable in industrial manufacturing.

This paper introduces the influence of tiny roughness structures on IL. Besides, this paper discusses the effect of current distribution on IL.

The bodies of aircraft structures have a lot of fastener holes and under different situations these holes bear external forces, which cause a tensile stress on the surface that leads to the failure of materials. Cold expansion process is one of the widely‐used methods to improve the fatigue behavior of materials used in aerospace industry, and such improvement is due to the compressive residual stress around cold expanded hole. The induced residual stress distribution around cold expanded hole is affected by several parameters such as, diametrical interfaces, surface finish of fastener holes, temperature, mandrel speed, i.e. the speed of inserting mandrel into the hole, and so on. In previous studies, most of effective parameters were investigated, whereas, the effect of mandrel speed on the residual stress distribution has not been considered. The present study, seeks to simulate cold expansion process on aluminum alloy 2A12TA using ABAQUS finite element (FE) package and to consider the effect of different mandrel speeds on residual stress distribution around cold expanded hole. It aims to verify the results of FE simulation by experimental data.

There are two kinds of data in this paper; experimental and FE results. The experimental results for cold expansion process have been extracted from the literature and ABAQUS finite element package was employed in order to simulate the above‐mentioned process. Moreover, FE results were validated by the experiments.

The results presented here show the influence of mandrel speed on residual stress distribution around cold expanded hole using a new analytical‐numerical method. The results gained by FE simulation show relative differences between the diagrams of residual stress distribution corresponding different mandrel speeds. It is shown in the paper; the residual stress around cold expanded hole rises by the increase of mandrel speed and consequently the improvement of fatigue life will be achieved.

The present study is part of Abbas Hosseini's MSc. dissertation, an original research work.

The purpose of this study is to investigate the synergism of convection, current density distribution and additives by numerical simulation and electrochemical experiments for good throwing power (TP) of copper electro-deposition in printed circuit board (PCB) manufacture.

The flow field of THs and current density distribution on various AR of THs are calculated and analyzed. Meanwhile, corresponding simulation is used to study the performance of plating electrolytes on TP. Two electrochemical parameters, overpotential (η) and potential difference (△η), are chosen to evaluate the electrochemical properties of different plating solutions by galvanostatic measurement and potentiodynamic cathode polarization at different rotating speeds.

By combining both the results of simulation and practical plating, these two electrochemical properties of electrolytes exhibit significant impact to the system at varied conditions. Especially, the electrolyte with higher polarizing η and △η values lead to the elevated TP for AR of more than 2:1.

The harring cell model is built as a bridge between the theoretical and experimental study for control of uniformity of plating THs in PCB manufacturing. This dual-parameter evaluation is validated to be a promising decisive method to guide the THs plating with particular AR in industry.

The purpose of this paper is to form good cutting qualities in glass-epoxy material for opening flexible areas of rigid-flex printed circuit boards (PCB) by ultraviolet (UV) laser cutting.

The cut width and cut depth of glass-epoxy materials were both observed to evaluate their cutting qualities. The heat affected zone (HAZ) of the glass-epoxy material was also investigated after UV laser cutting. The relationships between the cut width and the parameters of various factors were analyzed using an orthogonal experimental design.

The cut width of the glass-epoxy material gradually increased with the increment of the laser power and Z-axis height, while cutting speed and laser frequency had less effect on the cut width. Optimal parameters of the UV laser process for cutting glass-epoxy material were obtained and included a laser power of 6W, a cutting speed of 170 mm/s, a laser frequency of 50 kHz and a Z-axis height of 0.6 mm, resulting in an average cut width of 25 μm and small HAZ.

Flexible areas of rigid-flex PCBs are in good agreement with the cutting qualities of the UV laser. The use of a UV laser process could have important potential for cutting glass-epoxy materials used in the PCB industry.

Pb‐free soldering challenged printed circuit board (PCB) assembly with high temperature. The purpose of this paper is to explain the failure mechanism of printed circuit board (PCB) assembly with solder bubbles of vias to avoid the problems of via‐drilling defects and solder joint failure.

The failure of PCB vias with solder bubbles was investigated through cross sections and SEM microstructure inspection, TMA measurement, moisture absorption analysis and DSC measurement. The moisture absorption and CTE of FR4 laminate matched with manufacturing requirement to avoid the effects of solder bubbles. The effects of via drilling with a dull drill bit were compared to that with a new drill bit.

The moisture absorbed inside holes of via plating layers could be exposed to induce solder bubbles during Pb‐free soldering assembly and dull drill bits should be prevented during the drilling process to avoid the no‐bearing drilling effects.

The failure of PCB vias is not only involved in the voiding in solder joints but manufacturing processes of PCB. The paper designs an approach to analyse the properties of PCB materials and the drilling effects of vias to find out the mechanism resulting in solder bubbles of vias. The problem of drill bits should be considered to prevent the moisture absorbed in drilling vias with defects.

The purpose of this paper was to present a simple and convenient technology to produce the electronic-grade CuO. The prepared electronic-grade CuO fully meets the demands of industrial production of high density interconnect (HDI).

A new method termed as open-circuit potential-time technology is proposed to measure the dissolution time of CuO in plating solution. X-ray diffraction (XRD) scanning electron microscopy (SEM) and inductively coupled plasma-atomic emission spectroscopy (ICP-AES) were used to characterize the prepared CuO. Solder shock and reflow tests were carried out to examine the Cu deposits.

All aspects of the prepared CuO meet the demands of printed circuit board (PCB) industry.

A simple and convenient technology was presented to produce the electronic-grade CuO. A new method was proposed to determine the dissolution time of CuO in plating solution.